Method for manufacturing encoder substrate

Abstract

The invention relates to a manufacturing method of a coder substrate, in particular to form a plurality of conductive parts in narrow interval with high precision, and form the surfaces of the conductive part and the insulating substrate smoothly at the same time, wherein the conductive paste with carbon powder and adhesive resin is printed on the transfer printing plate (30) to form the first conductive layer (21), the conductive paste with silver powder and adhesive resin is printed on the first conductive layer (21) to form the second conductive layer (22), and then the shape of the conductive layer (23) composed of the first conductive layer (21) and the second conductive layer (22) is processed by pictures, a first conductive part (24) is formed in the surrounding open interval of the conductive layer (23), and a second conductive part (25) is formed in the internal surrounding open interval. And then the conductive part is collocated in the mould, the insulating substrate composed of resin is shaped by injection, the interval between the conductive parts is filled with resin; at last, through peeling off the transfer printing plate (30), the conductive layer (23) is transferred to the insulating substrate side.

Description

technical field [0001] The present invention relates to a method of manufacturing an encoder substrate capable of forming a plurality of conductive portions at small intervals with high precision, and of smoothly forming the surfaces of the conductive portions and the surface of an insulating substrate. Background technique [0002] Patent Document 1 below discloses a method of manufacturing an encoder substrate. [0003] In the invention described in Patent Document 1, as described in columns (0014) to (0022) of Patent Document 1, first, a carbon paste film is formed by printing on the carrier film 1, and after the carbon layer 2 is formed by heating, the carrier The film 1 is arranged in a primary mold 3, and injection molding is performed on a block of conductive plastic. [0004] Next, the conductive plastic block 4 is taken out from the primary mold 3, and the carrier film 1 is peeled off. At this time, the carbon layer 2 is pattern-transferred onto the conductive pla...

AI Technical Summary

Problems solved by technology

[0009] As a result, in the manufacturing method described in Patent Document 1, it is difficult to achieve a small interval of the conductive pattern 8, and steps are likely to occur between the surface of the conductive pattern 8 and the surface of the insulating plastic, so there is a problem that it is difficult to form a smooth surface. The sliding surface problem

Since it is necessary to use another mold to injection mold the conductive plastic block 4 and the insulating plastic, and because the shape of the mold is also complicated, there are also problems of complicated manufacturing methods and high costs.

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