Method for semiconductor factory automated resetting products identification code
A product identification code, factory automation technology, applied in the direction of comprehensive factory control, comprehensive factory control, instruments, etc., can solve the problems of reduced personnel costs, decreased productivity, prolonged delivery time, etc., to reduce personnel costs, improve productivity, and stabilize quality effect
Inactive Publication Date: 2008-10-15
GRACE SEMICON MFG CORP
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
When the user must change the product identification code (ID) due to customer demand or in order to grasp the production plan of the product, or when the semi-finished product of the semiconductor is in a waiting state, although the known technology is to continuously update the data in the system, but If the semi-finished product has a problem in the process or is running in the process equipment, the CIM system cannot change the identification code (ID) of the product. For the safety considerations in the semiconductor process, the CIM system will block the problem and the running The semi-finished products in execution, until the engineer detects that there is no problem with the semi-finished products or the semi-finished products leave the equipment, but the product identification code (ID) of these semi-finished products still retains the old product identification code (ID), which will make it difficult to achieve the company's production plan. And there are disadvantages of extended delivery time, unstable product quality, reduced productivity, reduced personnel costs and increased burden on engineers
In general, known technology will make the company's production structure may delay the normal operation and control
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more PUM
Login to view more
Abstract
The invention provides a method for automatic resetting an product identification code by a semiconductor factory, which utilizes a CIM system for judging the state of a semi-finished product, if the semi-finished product is in the waiting state without problems, the product identification code (ID) of the semi-finished product is immediately reset, if the semi-finished product is in the state with the event, the different processing method is carried out according to the type of the event to relieve the event of the semi-finished product, after that, the data of the semi-finished product in a system database is detected and updated, and the product identification code (ID) of the semi-finished product is immediately reset, thus allowing the CIM system to automatically reset the product identification code, enhancing the productivity, stabilizing the product quality, reducing the personnel cost, lowering the burden of engineers and further achieving the purpose of effectively mastering the normal operation of a production infrastructure of the semiconductor factory.
Description
Method for resetting product identification code in semiconductor factory automation technical field The invention relates to a method for setting a product identification code in a semiconductor factory, in particular to a method for automatically resetting a product identification code in a semiconductor factory. Background technique With the domestic labor cost rising gradually, labor shortage is common, coupled with the increasingly shortened life cycle of modern products, relative to the increasingly stringent requirements in terms of product quality, price, delivery time, etc., the automation of manufacturing industry, and even computer integrated manufacturing ( Computer Integrated Manufacturing (CIM) is an inevitable trend. However, the semiconductor industry has a very precise and complicated process, and the cost of machinery and equipment is high. In order to maintain the stable quality of products and improve production efficiency, we have always spared no effo...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more Application Information
Patent Timeline
Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06Q10/00G05B19/418G06Q50/04
CPCY02P90/02Y02P90/30
Inventor 曾繁祺潘海波
Owner GRACE SEMICON MFG CORP
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Try Eureka
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap