Process for producing polyimide film and polyimide film

Abstract

A solution containing a polyamic acid oligomer having at least one terminal alkoxysilyl group is applied to one side or both sides of a self-supporting film of a polyimide precursor solution, and then the self-supporting film is heated to effect imidization, thereby providing a polyimide film with reliably improved adhesiveness.

Description

Manufacturing method of polyimide film and polyimide film technical field The present invention relates to a method for producing a polyimide film with improved adhesion. Moreover, this invention relates to the polyimide film and copper laminated polyimide film obtained by these manufacturing methods. Background technique Polyimide films are widely used in fields such as electric and electronic equipment and semiconductor fields due to their excellent heat resistance, chemical resistance, mechanical strength, electrical properties, and dimensional stability. For example, as a flexible printed circuit board (FPC), a copper foil laminated substrate in which copper foil is laminated on one or both surfaces of a polyimide film is used. However, polyimide films have adhesive problems, and when metal foils such as copper foil are bonded with a heat-resistant adhesive such as an epoxy resin-based adhesive, the adhesion between the two may not be sufficiently improved. In addit...

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Problems solved by technology

Therefore, there may be a difference in adhesion between the A side and the B side

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