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Prepreg, process for producing prepreg, substrate, and semiconductor device

A manufacturing method and pre-forming technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, circuit substrate materials, etc., can solve the problem of excessive resin composition, circuit wiring patterns embedded in the resin layer, resin composition exudation, etc. question

Inactive Publication Date: 2012-07-04
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in the prepreg described in Patent Document 1, when the dimensions (circuit thickness, etc.) of the two embedded circuit wiring patterns are different, it is necessary to fill the gap between the wirings constituting the circuit wiring pattern (circuit wiring pattern gap) the amount of resin composition often produces excess or deficiency
As a result, problems such as bleeding of the resin composition to the side surface and inability to securely embed the circuit wiring pattern in the resin layer occurred in the produced substrate.
[0011] As mentioned above, when the prepreg described in Patent Document 1 is used, A: Impart the two characteristics of plating adhesion and embedment; B: Set the amount of the resin composition according to the embedded circuit wiring pattern. either is difficult
[0012] In addition, it has been difficult to manufacture preforms containing thin glass fiber substrates

Method used

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  • Prepreg, process for producing prepreg, substrate, and semiconductor device
  • Prepreg, process for producing prepreg, substrate, and semiconductor device
  • Prepreg, process for producing prepreg, substrate, and semiconductor device

Examples

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no. 1 approach

[0065] First, a preferred embodiment (first embodiment) of the prepreg of the present invention will be described with reference to the drawings.

[0066] figure 1 It is a sectional view showing an example (first embodiment) of the prepreg of the present invention.

[0067] Also, in the description below, the figure 1 (The same applies to the following figures), and the upper side will be described as "upper" and the lower side as "lower".

[0068] A prepreg (resin film for forming a multilayer wiring board) 10 has: a core layer 11 including a sheet-like base material (fibrous base material) 1; a first resin layer 2 formed on one side surface of the core layer 11; Two resin layers 3 are formed on the other side of the core layer 11 . Furthermore, in the prepreg 10 of the present embodiment, the composition of the first resin composition constituting the first resin layer 2 and the composition of the second resin composition constituting the second resin layer 3 are differen...

no. 2 approach

[0216] Next, a preferred embodiment (second embodiment) of the prepreg will be described with reference to the drawings.

[0217] Hereinafter, the prepreg of the second embodiment will be described focusing on differences from the prepreg of the above-mentioned first embodiment, and descriptions of the same matters will be omitted.

[0218] Figure 4 and Figure 5 It is a sectional view of an example (second embodiment) of the prepreg of the present invention. and also, Figure 4 and Figure 5 up and down are reversed.

[0219] The prepreg 10 of the second embodiment is, in the prepreg 10 of the above-mentioned first embodiment, the first resin composition and the second resin composition constituting the first resin layer 2 and the second resin layer 3, respectively. The compositions are the same, and the thicknesses of the first resin layer 2 and the second resin layer 3 are different.

[0220] In other words, if Figure 4 As shown, the prepreg 10 of the second embodi...

Embodiment 1

[0264] 1. Preparation of varnish for forming the first resin layer

[0265] 24% by weight of cyanate ester resin (primaset PT-30, weight average molecular weight about 2600, manufactured by Ronza Japan Co., Ltd.) as thermosetting resin, biphenyl dimethylene type epoxy resin as epoxy resin (NC-3000, Epoxy equivalent 275, manufactured by Nippon Kayakusha) 24% by weight, a copolymer of bisphenol A type epoxy resin and bisphenol F type epoxy resin as a phenoxy resin and a phenoxy resin (EP -4275, weight-average molecular weight 60000, manufactured by Japan Epoch Resin Co., Ltd.) 11.8% by weight, and 0.2% by weight of an imidazole compound (2-phenyl-4,5-dimethylolimidazole, manufactured by Shikoku Chemical Industry Co., Ltd.) as a curing catalyst was dissolved in methyl ethyl ketone. Further, 39.8% by weight of spherical fused silica (SO-25H, average particle diameter 0.5 μm, manufactured by Admatex Co., Ltd.) and 0.2% by weight of epoxysilane coupling agent (A-187, manufactured b...

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Abstract

This invention provides a prepreg that can cope with a demand for a film thickness reduction, enables different applications, functions, performances or properties or the like to be imparted respectively to both sides of the prepreg, and enables the amount of a resin composition to be set depending upon a circuit wiring pattern to be buried. There are also provided a process for producing the prepreg, a substrate comprising the prepreg, and a semiconductor device. The prepreg is characterized by comprising a core layer including a sheet-like base material, a first resin layer provided on one side of the core layer and formed of a first resin composition, and a second resin layer provided on the other side of the core layer and formed of a second resin composition, a conductor layer being provided on the first resin layer, at least one of a requirement that the first resin layer is different from the second resin layer in thickness and a requirement that the first resin composition is different from the second resin composition in composition, being satisfied.

Description

technical field [0001] The present invention relates to a preform, a method for producing the preform, a substrate, and a semiconductor device. Background technique [0002] The circuit board is formed using a prepreg obtained by impregnating a sheet-shaped base material such as a glass fiber base material with a thermosetting resin. For example, the prepreg disclosed in JP-A-2004-216784 can be obtained by immersing a glass fiber substrate having a thickness of approximately 50 to 200 μm in a thermosetting resin varnish. [0003] In the prepreg obtained by this method, the resin composition is loaded symmetrically around the glass fiber base material. In other words, this prepreg has a structure in which resin layers having the same thickness and composed of resin compositions of the same composition are provided on both sides of the glass fiber base material. [0004] However, along with the miniaturization and thinning of electronic components, electronic devices, etc. i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/24B32B27/04H01L23/14H05K1/03
CPCH01L2224/16225
Inventor 八月朔日猛汤浅圆滨谷和也马场孝幸
Owner SUMITOMO BAKELITE CO LTD