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Mold release agent solution for environment protection type capacitor and preparation method thereof

A release agent and capacitor technology, applied in the field of capacitor release agent solution and its preparation, can solve the problems of skin irritation, influence on the nervous system, environmental hazards, etc., achieve low adhesion, good film-forming effect, and ensure health Effect

Inactive Publication Date: 2010-10-27
南通市海门银燕电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, toluene or xylene is more harmful to the human body, affecting the human nervous system, stimulating the eyes, respiratory tract and skin, and causing harm to the environment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0011] Organic silicon and gasoline with an octane number not less than 95% are weighed in a weight ratio of 4:100, stirred in a magnetic stirrer for 10 to 15 minutes, and fully mixed to obtain an environmentally friendly capacitor release agent solution.

[0012] The prepared silicon solution is sprayed on the lead wire of the capacitor to form a good, uniform and smooth film. It has no effect on the welding performance of the lead wire and the cured epoxy resin, and has low adhesion to the epoxy resin. poison.

Embodiment 2

[0014] Organic silicon and gasoline with an octane number not less than 95% are weighed in a weight ratio of 3:100, stirred in a magnetic stirrer for 10 to 15 minutes, and fully mixed to obtain an environmentally friendly capacitor release agent solution.

Embodiment 3

[0016] Organic silicon and gasoline with an octane number not less than 95% are weighed in a weight ratio of 5:100, stirred in a magnetic stirrer for 10 to 15 minutes, and fully mixed to obtain an environmentally friendly capacitor release agent solution.

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PUM

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Abstract

The invention relates to a capacitor mold release solution and the preparation method thereof. The environment friendly capacitor mold release solution comprises a mold release solution and the solvent thereof, wherein, the mold release solution adopts organosilicon, the solvent adopts gasoline with the octane value being not lower than 95 percent, and the weight proportion of the organosilicon and the gasoline is (3 to 5):100. The environment friendly capacitor mold release solution adopts the preparation method that the organosilicon and the gasoline are weighed according to the weight proportion of (3 to 5):100, and then stirred for 10 to 15 minutes in a magnetic stirrer, to be perfectly mixed. The mold release solution has good, uniform and smooth film formation effect when being sprayed on the lead-out line of a capacitor, the welding performance and the cured epoxy resin of the lead-out line are not influenced, the adhesive force to the epoxy resin is low, the preparation is convenient, and the solution is nontoxic.

Description

technical field [0001] The invention relates to a capacitor release agent solution and a preparation method thereof. Background technique [0002] In the manufacture of film capacitors, it is necessary to use epoxy resin as its outer encapsulation. Due to the excellent adhesion of epoxy resin, it is inevitable to coat the lead-out wire of the capacitor with epoxy resin during product encapsulation. However, after the lead wire of the capacitor is wrapped with epoxy resin, the welding performance of the product cannot be satisfied. Therefore, the capacitor needs to be coated with a release agent on the lead wire before dipping epoxy resin. The selection of release agent and solvent is very important. It is required that after the lead-out wire is coated with release agent, the lead-out wire is uniform and smooth, has good film-forming property, has no effect on the cured epoxy resin, and has low adhesion to the resin. Moreover, it is required to be safe in operation, non-t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/33H01G4/228H01G4/224C08J3/09C08L83/06C08K5/5415
Inventor 曹青松
Owner 南通市海门银燕电子有限公司
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