Chemically machinery grinding device and method for cleaning grinding pad and grinding head

Abstract

The invention provides a chemical-mechanical grinding device and a method for cleaning a grinding pad and a grinding head; in the grinding device, a sleeve which can ascend and descend along the exterior wall of a chip platen is sheathed and arranged at the outside of the chip platen; when a chip is grinded, the sleeve descends to reveal the grinding pad, and the grinding head carries the chip to normally grind on the grinding pad; when the grinding pad and the grinding head need washing, the sleeve ascends to form a flume on the grinding platen; water is injected into the flume by a water inlet so that the grinding pad and the grinding head immerge in the flume; the water in the flume is vibrated by ultrasonic wave, thereby cleaning the grinding pad and the grinding head. The chemical-mechanical grinding device and the cleaning method solves the problem of chip-surface micro scratch caused by micro crystals and fine particles, thereby increasing the yield of chips and prolonging the service life of the grinding pad.

Description

technical field [0001] The invention relates to a chemical mechanical polishing device and method, in particular to a chemical mechanical polishing device and method capable of cleaning a polishing head and a polishing pad. Background technique [0002] With the progress of the semiconductor industry, 0.35um, 0.18um and other technologies have already matured, and the era of 90nm and 65nm has arrived. In order to obtain a better yield rate, it is more important to reduce the defects caused by the chip production process. [0003] Chemical mechanical polishing is an essential step in many processes of chip production. During the chemical mechanical polishing process of chips, the grinding head carries the chip and exerts a certain pressure to press the chip on the polishing pad for grinding. There are grooves or holes with a certain density on the polishing pad to keep the polishing liquid. If the liquid crystallizes or falls into other particles in these grooves or holes, it...

AI Technical Summary

Problems solved by technology

There are grooves or holes with a certain density on the polishing pad to keep the polishing liquid. If the liquid crystallizes or falls into other particles in these grooves or holes, it cannot be removed by spraying deionized water. With use, the grooves or holes gradually become shallower, and these crystals or particles are exposed, which will adhere to the chip surface or cause micro-scratches on the chip surface, seriously affecting the chip yield.

[0004] In addition, since there are gaps on the grinding head, there is also a chance that the grinding liquid crystals or other particles may be hidden, causing micro-scratches on the chip surface and affecting the chip yield.

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