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Method for forming a solder mold with venting channels and method for using the same

An exhaust channel, solder technology, used in welding equipment, manufacturing tools, electrical components, etc., can solve problems such as blocking the complete filling of the cavity

Inactive Publication Date: 2009-02-11
INT BUSINESS MASCH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when injecting solder into each cavity, the displaced air is allowed to escape through the seal, which would otherwise prevent complete filling of the cavity

Method used

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  • Method for forming a solder mold with venting channels and method for using the same
  • Method for forming a solder mold with venting channels and method for using the same
  • Method for forming a solder mold with venting channels and method for using the same

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Embodiment Construction

[0025] In describing the exemplary embodiments of the present disclosure which are illustrated in the drawings, specific terminology will be employed for the sake of clarity. However, the disclosure is not intended to be limited by the specific terms so selected, and it is to be understood that each specific component includes all equivalents that operate in a similar manner.

[0026] The Injection Molding Solder (IMS) process may be referred to as C4 New Process (C4NP). Exemplary embodiments of the present invention provide a solder mold including an exhaust structure for exhausting air replaced by molten solder during C4NP.

[0027] figure 2 is a flowchart illustrating a method for implementing an IMS process. First, a mold is formed (step S20). The mold may be formed by providing one or more cavities within the mold base. The mold base can be fabricated from any rigid material; however, materials with a CTE that approximately matches the coefficient of thermal expansio...

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PUM

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Abstract

The present invention relates to a solder mold with ventilation channels, a method for forming the solder mold, and a method for using the solder mold. A solder mold for transferring solder to a wafer comprises a substrate, a plurality of solder cavities for holding solder, and a plurality of ventilation channels between the plurality of solder cavities. The method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities.

Description

technical field [0001] The present disclosure relates to C4 solder dies, and more particularly, to C4 solder dies with vent channels. Background technique [0002] An integrated circuit (IC) is a miniaturized circuit incorporated into a small semiconductor chip or die. ICs are usually packaged or mounted to a wiring substrate made of organic or ceramic material and including multilayer wiring. For example, electrical connection is made between the IC and the first-level packaging substrate by a wire bonding method that forms fine wires to connect electrical leads of the IC to corresponding leads on the wiring substrate. [0003] Wire bonding has several disadvantages, for example, the electrical leads of the IC must be confined to the outer edges of the IC so that the bonding wires do not touch each other. An alternative to wire bonding is flip-chip solder bump interconnection, which provides an increased number of electrical connections as an area array. [0004] In flip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60B23K3/06B23K101/40
CPCH01L2924/0002H05K3/3457C03C19/00H05K2203/1178H05K2203/0338B23K2201/40B23K3/0623H05K2203/0113H05K2203/0126B23K2101/40H01L2924/00
Inventor R·J·贝萨马R·A·巴德E·G·科尔根P·A·格鲁伯尔V·奥伯森
Owner INT BUSINESS MASCH CORP