Power converter

A power conversion device and power conversion technology, applied in the direction of power consumption devices, control devices, power electronics modification, etc., can solve problems such as loss, and achieve the effect of reducing and suppressing thermal influence

Inactive Publication Date: 2009-02-18
HITACHI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the heat generation of the semiconductor chip is also ca

Method used

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Embodiment 1

[0017]

Below, refer to Figure 1- Figure 8 , and describe the first embodiment of the present invention.

[0018]

First, use Figure 8 Describe the hybrid electric vehicle of this embodiment.

[0019]

A hybrid electric vehicle (hereinafter referred to as "HEV") of this embodiment is an electric vehicle including two drive systems. One is an engine system using an internal combustion engine, the engine 104, as a power source. The engine system is mainly used as a driving source of the HEV. The other is an on-vehicle electric power system using motor generators 130 and 140 as power sources. The on-board power system is mainly used as the drive source of HEV and the power generation source of HEV.

[0020]

A front wheel axle 102 is rotatably supported at a front end portion of a vehicle body (not shown). At both ends of the front wheel axle 102, a pair of front wheels 101 are provided. Although not shown, the rear end portion of the vehicle body is rotatably suppor...

Embodiment 2

[0070]

Below, refer to Figure 9 , and describe the second embodiment of the present invention.

[0071]

This embodiment is an improved example of the first embodiment, and the same components are assigned the same symbols, and will not be described again.

[0072]

The difference between this embodiment and the first embodiment is that a third cooling cavity surrounded by the upper casing 10 and the second upper casing 19 is formed on the upper part of the cooling cavity containing the semiconductor modules 20 and 30, and the drive circuit A substrate 97 including a substrate, a control circuit substrate, and a connector substrate is accommodated therein.

[0073]

The wiring sheets of the semiconductor modules 20 and 30 and the substrate 97 are electrically connected by a wiring member 98 .

[0074]

The capacitor case of the capacitor 50 is omitted and replaced by pi-shaped legs of the second base 12 . Therefore, the π-shaped legs of the second base 12 are formed ...

Embodiment 3

[0077]

Next, a third embodiment of the present invention will be described with reference to FIG. 10 .

[0078]

This embodiment is an improved example of the first embodiment, and the same components are given the same symbols, and will not be repeated.

[0079]

The difference between the present embodiment and the first embodiment is that the drive circuit boards 70 and 71 together with the AC bus bars 60 and the terminal holder 63 are housed in the cooling chamber for housing the semiconductor modules 20 and 30 .

[0080]

In addition, a second cooling chamber is formed by the second base 12 below the cooling chamber in which the semiconductor modules 20 and 30 are accommodated, and further below, two third cooling chambers are formed by the second base 12 . The capacitor 50 is housed in the second cooling chamber; the control circuit board 74 is housed in one of the third cooling chambers; and the connector substrate 72 is housed in the other third cooling chamber. ...

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PUM

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Abstract

A power converter comprises semiconductor modules (20, 30) constituting the main circuit for power conversion, a capacitor (50) electrically connected to the main circuit drive circuit boards (70, 71) each having a drive circuit for supplying a drive signal for operating power conversion to the main circuit, a control circuit board (74) having a control circuit for supplying the control signal for supplying the drive signal to the drive circuits, and a casing containing the above components. In the casing, a cooling chamber having a coolant passage (28) and a peripheral wall defining the chamber and composed of a heat-conductive member is provided. At least the semiconductor modules (20, 30) are contained in the cooling chamber, and at least the capacitor (50) and the control circuit board (74) are installed outside the cooling chamber. The power converter in which the thermal influence of the semiconductor modules on the constituent components other than the semiconductor modules is mitigated.

Description

technical field [0001] The present invention relates to a power conversion device that converts input power into predetermined power and outputs it. Background technique [0002] As a background art related to a power conversion device, for example, an inverter device disclosed in Patent Document 1 is widely known. Patent Document 1 discloses a technology for realizing miniaturization of the converter, which uses a base as a medium to stack and arrange switching elements, power modules, smoothing capacitors, and control components in a casing in this order. [0003] Patent Document 1 specifically describes a braking force control technique. [0004] Patent Document 1: JP Unexamined Publication No. 2003-199363 [0005] In recent years, further cost reductions have been demanded for power conversion devices that control the driving of vehicle-driving electric motors mounted on automobiles. This is to reduce the cost of the electric drive system mounted on the vehi...

Claims

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Application Information

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IPC IPC(8): H02M7/48B60L50/16
CPCH02M7/003H05K7/20927H05K7/2089H05K7/20872B60L3/003B60L15/007B60L15/20B60L2210/10B60L2210/30B60L2210/40B60L2220/14B60L2220/42B60L2240/12B60L2240/36B60L2240/421B60L2240/441B60L2240/525B60L2260/26B60L2260/28Y02T90/16B60L50/61B60L50/16Y02T10/62Y02T10/64Y02T10/70Y02T10/72Y02T10/7072H01L2224/49175H01L2924/19107H01L2224/48139
Inventor 中津欣也中村卓义斋藤隆一须贺卓船户祐树
Owner HITACHI LTD
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