Low-melting point lead-less glasses powder for frit slurry, and preparation and use thereof

Abstract

The invention discloses lead-free glass dust with low melting point used for glass frit slurry, as well as the preparation method and the application thereof. The lead-free glass dust is characterized in that the compositions have the following weight percentages: 50%-70% of bismuth oxide, 0.1%-30% of boric oxide, 0.1%-30% of zinc oxide, 0.1%-10% of aluminium oxide, 0.1%-10% of silicon oxide, 0.1%-10% of magnesia magnesium oxide, 0.1%-10% of titania titanium dioxide, 0.1%-5% of sodium monoxide, 0.1%-5% of potassium oxide, 0.1%-5% of calcium oxide, 0.1%-2% of cerium oxide, and 0.1%-2% of cerium oxide. The preparation method comprises the following steps: all raw materials are fully mixed; the mixed mixture is put into a crucible, and is then put into an electric furnace at the furnace temperature of 1200-1450 DEG C; the melted glass slurry is poured into a tablet machine for being pressed into sheets or poured into cold water; the flaky or granule glass and dye are put into a ball mill together for ball milling; the glass dust after the ball milling process is screened and bagged; and the glass dust is applicable to the glass frit slurry field of the dielectric layers of plasma displays, fluorescent displays and the like. The invention has the advantages that the glass dust has good insulation and high dielectric constant, and is applicable to screen printing.

Description

【Technical field】 [0001] The invention relates to the field of glass powder, in particular to low-melting-point lead-free glass powder for glass frit paste and its preparation method and application. 【Background technique】 [0002] Glass frits used in plasma display (PDP) and fluorescent display (VFD) dielectric layer frit pastes are low melting point glasses. In low-melt sealing glass, lead-containing sealing glass has a series of characteristics such as large resistance, low dielectric loss, high refractive index and dispersion, absorption of high-energy radiation, low softening temperature, and good chemical stability. has a wide range of uses. PbO-SiO is often used in the preparation of lead-containing low-melting glass at home and abroad 2 , PbO-B 2 o 3 , Pb0-B 2 o 3 -SiO 2 , PbO-ZnO-B 2 o 3 and other systems. The poisoning dose of lead is only 1mg, and the lethal dose is 1g, but the PbO content in most commercial low-melting glass is even as high as 60-80wt%,...

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Problems solved by technology

[0006] Asahi Glass Special Fair 7-25568 proposes PbO-SiO that can be used in the dielectric layer of ion display (PDP) and fluorescent display (VFD) 2 It is a glass frit paste, and its glass composition contains: PbO, SiO 2 、Al 2 o 3 , SnO 2 、TiO 2 , CaO, BaO, CeO 2 , La 2 o 3 、B 2 o 3 , ZnO, SrO, MgO, the expansion coefficient is 80~90×10 -7 Near / ℃, the expansion coefficient is reduced by adding fillers, and the densification of the dielectric layer is realized through the optimization of the composition of the lead glass and the proper proportion of the fillers. However, the biggest disadvantage is that it contains a large amount of lead oxide (>50wt %), can not meet the current demand for lead-free

[0007] U.S. Patent No. P5153151 discloses a phosphate low-melting glass whose molar composition is Li2O: 0-15%, Na 2 O: 0~20%, K 2 O: 0-10%, ZnO: 0-45%, Ag 2 O: 0-25%, Tl 2 O: 0-25%, PbO: 0-20%, CuO: 0-5%, CaO: 0-20%, SrO: 0-20%, P 2 o 5 : 24~36%, Al 2 o 3 : 0~5%, CeO2: 0~2%, BaO: 0~20%, SnO: 0~5%, Sb 2 o 3 : 0~61%, Bi 2 o 3 : 0~10%, B 2 o 3 : 0 to 10%, the transition temperature of the glass is 300 to 340°C, and the coefficient of thermal expansion is 135. The disadvantage of the glass is that Tl 2 O is very toxic. At the same time, glass has a large thermal expansion coefficient and cannot be used for sealing with medium and low expansion coefficients. At the same time, its chemical stability and insulation resistance cannot meet the requirements of plasma displays (PDP) and fluorescent displays (VFD).

[0008] The mole percentage of the glass composition disclosed in Japanese Patent No. H7-69672 is: P 2 o 5 : 25 to 50%, SnO: 30 to 70%, ZnO: 0 to 25%, adding B on this basis 2 o 3 、WO 3 , Li 2 O, etc., the transition temperature of the glass is 350-450°C, and the coefficient of thermal expansion is greater than 120×10 -7 / °C, the method of using fillers in the patent reduces the expansion coefficient of the glass, but affects the fluidity and airtightness of the glass during sealing, and its chemical stability is not high

[0009] Hitachi Manufacturing Co., Ltd. has announced a vanadium oxide (V 2 o 5 ) is a low melting point glass, the sealing temperature is less than 400°C, and the thermal expansion coefficient is 90×10 -7 / °C, but in this glass, lead oxide is a necessary component, which cannot meet the requirements of lead-free. At the same time, it also contains highly toxic thallium oxide

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