Cabinet cover and air flow guiding method using the cabinet cover

Abstract

The invention discloses a case cover and an air flow guiding method applying the case cover. The case cover is applied to covering a case of electronic equipment with a heating piece; furthermore, the case cover is concavely arranged with a blocking part corresponding to the heating piece; a clearance is reserved between the blocking part and the heating piece to compose an air flow guiding channel, through which an air flow formed by the running of an air flow generating device that is arranged in the case and is corresponding to one side of the heating piece is forced to go.

Description

technical field [0001] The invention relates to an airflow guiding technology, more specifically, a case cover applied to a case of electronic equipment and an airflow guiding method using the case cover. Background technique [0002] With the rapid development of electronic technology, the functions of existing electronic equipment are becoming more and more powerful, and the speed of replacement is also increasing rapidly. Correspondingly, the heat dissipation problem of electronic equipment has once again become one of the key problems that manufacturers need to solve. For example, the popular The heat of a dual-core processor is much larger than that of the previous central processing unit. Therefore, servers, notebook computers, and desktop computers using the dual-core processor need to consider more internal heat dissipation issues. [0003] Of course, in addition to heat-generating components such as processors, as the functions of other heat-generating components su...

AI Technical Summary

Problems solved by technology

[0006] However, there will be many problems in this way, because the wind deflector 2 is fixed on the main board 10, and a large amount of boards, electronic components, etc. will be inserted on the main board 10, so there is very little extra space to place the main board 10. The wind deflector 2 needs to occupy a limited space; moreover, when the available space is relatively small, it is necessary to use positioning members such as screws to fix the wind deflector 2 in the limited space, or to insert other boards and electronic components into the limited space. Motherboard 10 all can cause assembly inconvenience, and increased work difficulty

At the same time, the air guide cover 2 required for airflow guidance must be made of other materials such as hard plastic, which also relatively increases the production cost, which is not conducive to enterprise benefits, and it is compatible with the current tool-less assembly and reduces costs. (costdown) trend is out of place

[0007] In addition, when the central processing unit 11 on the motherboard 10 needs to be replaced or disassembled, the air guide cover 2 must be removed before the central processing unit 11 can be pulled out, which is very inconvenient and reduces work efficiency.

Images