Multilayer flexible circuit board
A flexible circuit board and circuit board technology, applied in multilayer circuit manufacturing, printed circuit components, etc., can solve problems such as product wrinkles, failure to meet bending life requirements, and reduce efficiency, so as to simplify the production process and avoid wrinkles Unfavorable, the effect of reducing production costs
Inactive Publication Date: 2011-04-06
靖江栩栩传媒有限公司
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Problems solved by technology
However, if the employees operate improperly, it is easy to cause wrinkles in the product. In addition, manual layering is also easy to miss the layering. For example, it should be divided into five layers but actually only divided into three layers, and there are two layers that have not been separated. Such a product If it flows into the customer's place, it will not meet the bending life requirements, which will have a fatal impact on the mobile phone; at the same time, manual rubbing and layering are time-consuming and laborious, increasing production man-hours, reducing efficiency and increasing costs.
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[0017] Such as Figure 3 to Figure 5 As shown, the multilayer flexible circuit board in this embodiment includes at least two layers of circuit boards stacked, and now only two-layer circuit boards are used as an example for illustration. The two-layer circuit boards are respectively defined as the first layer of circuit boards and the second layer of circuit boards. circuit board. The multi-layer flexible circuit board includes a first-layer circuit board 1, a second-layer circuit board 2, and a first-layer and second-layer circuit board 1, 2 and bonded to the first-layer and second-layer circuit board 1 , 2 of the prepreg 3 . The central position of the prepreg 3 has a through hole 31, and the first layer circuit board 1 has a first glue-free area 11 aligned with the through hole 31 and a first adhesive area 12 bonded to the upper surface of the prepreg 3 , the second layer circuit board 2 has a second non-adhesive area 21 aligned with the through hole 31 and a second adhe...
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The invention discloses a multi-layer flexible circuit board, comprising at least two layers of circuit boards; adjacent layers of the circuit boards are bonded to each other by prepreg; the prepreg is provided with a through hole; one of the adjacent layers of the circuit boards is provided with a first glue-free area aligned to the through hole and a first glued area which is bonded to the prepreg; the other one of the adjacent layers of the circuit boards is provided with a second glue-free area aligned to the through hole and a second glued area which is bonded to the prepreg; the first glue-free area, the second glue-free area and the circumferential wall of the through hole enclose a chamber; the second glue-free area is provided with a ring of bulge which extends into the chamber; by the blocking function of the bulge, the volatile fog-typed prepreg can be prevented from flowing into the chamber, therefore, the delamination of adjacent layers of circuit boards is realized, the bending service life of the multi-layer flexible circuit board is prolonged, furthermore, as single delamination procedure is not needed to be arranged, the preparation flow is simplified, the workingtime is saved and the production cost is reduced.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a multilayer flexible circuit board. Background technique [0002] Multi-layer flexible circuit boards are usually used in the field of clamshell mobile phones. The normal life of the mobile phone clamshell needs to reach more than 100,000 times. Therefore, the bending area of the multi-layer flexible circuit board is designed as a single-layer area during design, that is The area allows each layer of circuit boards to be separated in order to meet the bending life requirements of mobile phones. [0003] When the existing multi-layer flexible circuit board is made, it is formed by compounding and pressing multiple circuit boards together through thermosetting adhesive, and the bending area does not need to be glued, that is, there is a gap between the circuit boards of adjacent layers. Adhesive area and no adhesive area, the multilayer flexible circuit board is disclosed in the C...
Claims
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IPC IPC(8): H05K1/02H05K3/46
Inventor 陈伟华张沈宁
Owner 靖江栩栩传媒有限公司