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Method for preparing radiating module

A manufacturing method and heat dissipation module technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of good heat dissipation effect, unreachable, few exposed parts of heat dissipation fins, etc., and achieve good heat dissipation effect , the effect of increasing the contact area

Active Publication Date: 2009-04-15
THERMALTAKE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the above-mentioned existing heat dissipation device is used alone or in conjunction with a fan to dissipate heat, since the heat dissipation fins are set in correspondence with each other, the first heat dissipation fin will block the heat dissipation fins behind, and As a result, the exposed parts of the heat dissipation fins in contact with the air are less, resulting in poor air convection when the heat dissipation device is used without a fan. There are few exposed parts in contact with the air, so that when the fan guides the gas, its first cooling fin will block the rear cooling fins, so that the gas cannot be guided to the cooling fins, causing the cooling fins to be affected by the wind. The area is limited, and it is impossible to achieve a better heat dissipation effect

Method used

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  • Method for preparing radiating module
  • Method for preparing radiating module
  • Method for preparing radiating module

Examples

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no. 1 example

[0030] see figure 1 , 2 , which are respectively a schematic view of the manufacturing method of the present invention and a schematic view of the three-dimensional appearance of the first embodiment of the present invention. As shown in the figure, the first embodiment of a manufacturing method of a heat dissipation module disclosed in the present invention at least includes the following steps:

[0031] A heat conduction unit 1 is provided, which includes a plurality of heat pipes 11 and a base 12, the heat pipes 11 respectively have a heating section 111 and a cooling section 112, and the heating sections 111 are combined with the base 12;

[0032] A plurality of cooling plate bodies 21 are provided, and these cooling plate bodies 21 are respectively provided with a plurality of adjacent protrusions 23 on their outer peripheral edges, and these cooling plate bodies 21 are respectively provided with a plurality of fixing holes 25 and a plurality of fixing holes 25 on their ...

no. 2 example

[0038] see Image 6 As shown, it is a schematic perspective view of the fourth embodiment of the present invention. Please also refer to figure 1 , the second embodiment of a manufacturing method of a heat dissipation module of the present invention, which at least includes the following steps:

[0039] 1. Provide a heat conduction unit 1, which includes a plurality of heat pipes 11 and a base 12, the heat pipes 11 respectively have a heating section 111 and a cooling section 112, and the heating sections 111 are combined with the base 12;

[0040] 2. Provide a plurality of heat dissipation units 2c, 20c, these heat dissipation units 2c, 20c respectively have a plurality of heat dissipation plate bodies 21c, and these heat dissipation plate bodies 21c are respectively provided with a plurality of adjacent protrusions 23c on their outer peripheries, These cooling plate bodies 21c are respectively provided with a plurality of fixing holes 25c on their surfaces, and these cooli...

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Abstract

The invention discloses a preparation method used for a heat dissipation module, which provides a heat guide unit which has a plurality of heat conduction pipes and a base; each heat conduction pipe comprises a heated section which is combined with the base; furthermore, the preparation method also provides a heat dissipation plate with convex parts arranged on a plurality of external circumferential edges and a plurality of fixed holes arranged on the surface; subsequently, all heat dissipation plate bodies are respectively stacked on the cooling sections of all heat conduction pipes intermittently by fixed holes, thus forming a heat dissipation unit; furthermore, the convex parts at the circumferential edges during the assembly process of all heat dissipation plate bodies can form malposition. Therefore, the heat dissipation unit with the required shape can be stacked; furthermore, the contact area between all heat dissipation plate bodies and the external air is increased, and the heat dissipation module has good heat dissipation effect.

Description

technical field [0001] The present invention relates to a manufacturing method of a heat dissipation module, in particular to a heat dissipation module capable of stacking required types of heat dissipation units, and increasing the contact area between each heat dissipation plate and the external air, and having a better heat dissipation effect production method. Background technique [0002] Generally, in the existing heat dissipation device, one end of a plurality of heat pipes is joined to a base, and a plurality of coaxial perforations are respectively provided on a plurality of heat dissipation fins, and then each heat dissipation fin is stacked one by one on each heat pipe through the through holes. On the other hand, the heat dissipation fins are fixedly connected to the heat pipe, and the heat dissipation fins are arranged in parallel so that the surfaces thereof correspond to each other, so that there is an appropriate width between the heat dissipation fins. Ther...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/36
Inventor 林培熙
Owner THERMALTAKE