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In-situ etching method of shadow masks of a continuous in-line shadow mask vapor deposition system

A shadow mask and vapor deposition technique used in chemical instruments and methods, cleaning methods and utensils, vacuum evaporation plating, etc.

Inactive Publication Date: 2009-04-22
ADVANTECH GLOBAL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Heretofore, the problem with this system is that each shadow mask must be removed from the system to be cleaned and then returned to the system to prevent build-up of deposited material on the surface and in the pores of each shadow mask, which Stacking adversely affects the size of the pattern deposited on the substrate through the shadow mask

Method used

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  • In-situ etching method of shadow masks of a continuous in-line shadow mask vapor deposition system
  • In-situ etching method of shadow masks of a continuous in-line shadow mask vapor deposition system
  • In-situ etching method of shadow masks of a continuous in-line shadow mask vapor deposition system

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Embodiment Construction

[0022] An electronic device comprising one or more electronic components deposited on a substrate for controlling one or more controlled components which may be separate from or an integral part of the above electronic device, and also relates to A method of manufacturing the above electronic device. In the following description, the electronic device described is an active matrix backplane having an array of organic light emitting diodes (OLEDs) deposited on the active matrix backplane so that the selectivity is controlled. However, this does not constitute a limitation of the present invention, because any type of electronic components such as thin film transistors, diodes, capacitors, or storage elements can be formed on the substrate to control any type of electronic components formed or not formed on the substrate. The controlled element is controlled. The following description will be made with reference to the drawings in which like reference numerals correspond to lik...

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Abstract

In a method of using and cleaning one or more shadow masks of a shadow mask vapor deposition system used to form an electronic device, a substrate is advanced through series connected deposition vacuum vessels. As the substrate advances through each deposition vacuum vessel, material from a material deposition source positioned in the deposition vacuum vessel is deposited on the substrate through a shadow mask positioned therein. The material is also deposited on a surface of the shadow mask that faces the one material deposition source. Following the deposit of material on the surface of the shadow mask in at least one deposition vacuum vessel, a reactive gas is introduced into the deposition vacuum vessel absent the substrate therein. The reactive gas is then ionized to remove the material deposited on the shadow mask.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Provisional Patent Application No. 60 / 979,957, filed October 15, 2007, which is hereby incorporated by reference into this application. technical field [0003] The invention relates to a method for in-situ cleaning of a shadow mask in a continuous linear shadow mask vapor deposition system. Background technique [0004] US Patent No. 6,943,066 discloses an exemplary continuous in-line shadow mask vapor deposition system, which is incorporated herein by reference. Heretofore, the problem with this system is that each shadow mask must be removed from the system to be cleaned and then returned to the system to prevent build-up of deposited material on the surface and in the holes of each shadow mask, which Stacking adversely affects the dimensions of the pattern deposited on the substrate through the shadow mask. [0005] The embodiments described below attempt to overcome the afo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/12B08B7/00H01L21/00
CPCH01L51/56H01L2227/323H01L21/67028C23C14/564C23C14/56C23C14/042H10K59/1201H10K71/40H10K71/166H10K71/00
Inventor 托马斯·彼得·布罗迪约瑟夫·A·马尔卡尼奥
Owner ADVANTECH GLOBAL LTD