Medium pulp for large power thick film circuit and preparation thereof

A technology of dielectric paste and thick film circuit, applied in conductive materials dispersed in non-conductive inorganic materials, etc., can solve problems such as inapplicability, and achieve the effects of high breakdown strength, excellent thixotropy, and high insulation resistance

Active Publication Date: 2010-10-06
ZHUZHOU LEEDINK ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Among the above-mentioned requirements for dielectric paste, the dielectric paste for high-power thick film circuits based on 430 stainless steel (1Cr17 series) substrates has been mature and commercialized, but this dielectric paste cannot be applied to 304 (OCr18Ni9 series) and 316 (Cr18Ni12Mo2-3 and other series) stainless steel substrates, while 304 and 316 stainless steel have excellent corrosion resistance and good intergranular corrosion resistance; excellent cold and hot processing and forming properties and good toughness; Non-magnetic alloyed austenitic stainless steel material of carbon, nickel and chromium, the material properties of which are not affected by heat treatment

Method used

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  • Medium pulp for large power thick film circuit and preparation thereof
  • Medium pulp for large power thick film circuit and preparation thereof

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preparation example Construction

[0020] The preparation method of the dielectric paste for high-power thick film circuit of the present invention is characterized in that the following steps:

[0021] (1) To prepare glass-ceramic powder, mix the components of the glass-ceramic powder in a mixer according to the above-mentioned proportion range, and then put them into a high-temperature furnace for smelting. The melting temperature is 1200-1600° C., and the holding time is 1-6 hours. water quenching to obtain glass micro-slag, and place the glass micro-slag in a ball mill to grind to obtain glass-ceramic powder with a particle size not greater than 5 microns;

[0022] (2) To prepare an organic binder, mix and dissolve the components of the organic binder in a water bath furnace at a temperature of 80-100° C. to form an organic binder and control its viscosity to 200-300mPa s;

[0023] (3) Put the prepared glass-ceramic powder and organic binder in the container according to the above-mentioned ratio range, st...

example 1

[0026] Preparation of glass-ceramic powder, composition and weight ratio of glass-ceramic powder: SiO 2 7 copies, B 2 o 3 3 copies, Al 2 o 3 4 parts, 35 parts of BaO, 5 parts of CaO, 4 parts of MgO, ZrO 2 3 copies, Co 2 o 3 3 parts, TiO 2 1 part; the above composition is placed in a high-temperature electric furnace, the melting temperature is 1350°C, and the temperature is kept for 3 hours. After water quenching, it is coarsely ground with a vibrating ball mill to obtain a coarse powder, and then finely ground with a planetary ball mill or a stirring ball mill to obtain a maximum particle size of no more than 5 micron glass-ceramic powder for use;

[0027] Preparation and dissolution process of organic binder, composition and weight ratio of organic binder: 94 parts of tributyl citrate, 0.3 parts of 1,4-butyrolactone, 5 parts of nitrocellulose, 0.3 parts of hydrogenated castor oil 1 part, 0.4 part of lecithin, the dissolution process is to mix, stir and dissolve...

example 2

[0034] Weight ratio of glass-ceramics: SiO 2 20 copies, B 2 o 3 7 copies, Al 2 o 3 8 parts, 55 parts of BaO, 9 parts of CaO, 7 parts of MgO, ZrO 2 6 copies, Co 2 o 3 5 parts, TiO 2 2 parts; organic binder weight ratio and dissolution process: 89 parts of tributyl citrate, 5 parts of 1,4-butyrolactone, 4 parts of nitrocellulose, 1 part of hydrogenated castor oil, 1 part of lecithin, The dissolution process is to mix, stir and dissolve each composition of the above-mentioned organic binder in a water-bath furnace at a temperature of 90° C., and keep the temperature for 4 hours.

[0035] The weight ratio of glass-ceramic powder and organic binder in the slurry mixing process is 70 parts: 30 parts, and the solid content of the medium slurry of output is 70%, and all the other are the same as example 1

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Abstract

The invention discloses a dielectric paste used for a high-power thick film circuit and a preparation method thereof. The invention aims at preparing a dielectric paste matched with a 304 or a 316 stainless steel base plate. The dielectric paste is characterized in that neoceramic glass powder consisting of SiO2, B2O3, Al2O3, BaO, CaO, MgO, ZrO2, Co2O3 and TiO2, and organic binder consisting of tributyl citrate, 1, 4-butyrolactone, nitroncellulose, hydrogenated castor oil and lecithin are put into a container according to the weight proportion that the ratio of the neoceramic glass powder andthe organic binder is 70-90 parts by weight to 30-10 parts by weight to be stirred, and then are milled by a three-high mill, so that the finished product dielectric paste is obtained. The invention is mainly used as the dielectric paste which forms the high-power thick film circuit on the 304 or the 316 stainless steel base plate.

Description

[0001] The invention relates to a dielectric slurry and a preparation method thereof, in particular to a dielectric slurry for a high-power thick-film circuit and a preparation method thereof. Background technique [0002] High-power thick-film circuit components have the characteristics of high power density, high mechanical strength, thermal shock resistance, and vibration resistance, which put forward corresponding mechanical and thermal performance requirements for the substrate. The excellent mechanical and physical properties of metals make it possible to be used as substrate materials, but this also brings problems such as the mismatch between the expansion coefficient and the commonly used electronic pastes, and the oxidation caused by the thick film firing process. [0003] Stainless steel as a substrate material puts forward technical requirements different from general dielectric pastes for the preparation of high-power thick-film integrated circuits. 1. Process per...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/14
Inventor 堵永国杨华荣李刚张传禹
Owner ZHUZHOU LEEDINK ELECTRONICS TECH CO LTD
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