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Sram device with enhanced read/write operations

A device and memory technology, applied in the field of static random access memory, can solve problems such as low performance, discharge delay, and long interconnection path

Inactive Publication Date: 2009-05-06
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] A disadvantage of the existing SRAM device is: due to the relatively long interconnection path between the second metallization layer and the fourth metallization layer, which causes the RC effect, the pair of bit lines BL through the global bit line GBL and the global complementary bit line GBLB and complementary bit line BLB discharge (discharge) may be delayed
As a result, the performance of traditional SRAM devices is less than ideal, which provides room for further improvement of device performance

Method used

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  • Sram device with enhanced read/write operations
  • Sram device with enhanced read/write operations
  • Sram device with enhanced read/write operations

Examples

Experimental program
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Embodiment Construction

[0014] This invention describes SRAM devices with enhanced read / write operations. The following examples merely illustrate various embodiments of the invention for the purpose of explaining the principles thereof. It can be understood that although there is no explicit description here, those skilled in the art will be able to derive various designs that are equivalent to the principles of the present invention embodied.

[0015] image 3 A block diagram of a memory array 300 of an SRAM device according to one embodiment of the present invention is shown. The memory array 300 includes one or more memory cells 302 arranged in columns. The memory cell 302 is coupled between a local bit line BL and a complementary local bit line BLB through which the memory cell 302 can be accessed for read and write operations. The local bit line BL and the complementary local bit line BLB are connected to the write control module 304 to write data into the storage unit 302 .

[0016] A glob...

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Abstract

An SRAM device includes: a first group of memory cells connected to a first local bit line and a first local complementary bit line for accessing data nodes thereof; a second group of memory cells connected to a second local bit line and a second local complementary bit line for accessing data nodes thereof; and a global bit line and a global complementary bit line connected to the first and second local bit lines for accessing data nodes of the first and second groups of memory cells, wherein the first local bit line, the first local complementary bit line, the second local bit line, the second local complementary bit line, the global bit line and the global complementary bit line are constructed on a same metallization level in the SRAM device.

Description

technical field [0001] The present invention relates generally to integrated circuit design, and more particularly to a static random access memory (SRAM) with enhanced read / write operations. Background technique [0002] SRAM is a type of memory that can hold data as long as it is powered, without constantly refreshing it. figure 1 A circuit diagram 100 of a standard 6-tube SRAM cell with two cross-coupled inverters 102 and 104 is schematically shown. The inverter 102 includes a pull-up transistor 114 and a pull-down transistor 116 . The inverter 104 includes a pull-up transistor 118 and a pull-down transistor 120 . The first storage node 106 of the inverter 102 is directly connected to the gates of the two transistors of the inverter 104 . The second storage node 108 of the inverter 104 is directly connected to the gates of the two transistors of the inverter 102 . The first storage node 106 of the inverter 102 is written to and read from by a pass-gate transistor 110,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/41G11C11/413
CPCH01L27/1104G11C11/412H10B10/12
Inventor 李政宏王屏薇吴经纬林书玄张峰铭廖宏仁
Owner TAIWAN SEMICON MFG CO LTD