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Printed wiring board

A printed circuit board, printed board technology, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve problems such as inability to be removed, peelable solder resist hardening, etc., to achieve the effect of inhibiting adhesion to the contactor

Active Publication Date: 2009-05-13
KK TOKAI RIKA DENKI SEISAKUSHO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, according to an experiment conducted by the applicant of the present application, it has been found that at the heating temperature used to melt the above-mentioned lead-free solder, the strippable solder resist hardens and cannot be removed

Method used

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  • Printed wiring board
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Examples

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Embodiment Construction

[0031] combine now Figure 1A Turning to FIG. 5, an embodiment of the present invention is described.

[0032] Such as Figure 1A and 1B As shown in , a printed wiring board 1 is formed of a board having an upper surface and a lower surface including an A surface 10a and a B surface 10b, and is provided with a rectangular through hole 11 into which an LED (Light Emitting Diode) 3 is inserted. A conductive layer having an unillustrated conductive pattern printed thereon is formed on the A surface 10 a of the printed wiring board 1 . A part of the conductive layer is exposed as a plurality of (two in this embodiment) contacts 2 , and the light emitting portion 3 a of the LED 3 is exposed from the through hole 11 . When a pair of contacts 2 are electrically connected by a conductor not shown, the pair of contacts 2 functions as a switch. The LED 3 and the electronic component 4, both of which are electronic components, are mounted on the B surface 10b of the printed wiring bo...

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PUM

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Abstract

In a printed wiring board, contacts are formed only on one side surface of a printed board, and electronic components are arranged only on the other side surface of the printed board. Then, soldering work employing Pb free solder is conducted only on the other side surface of the printed board on which the electronic components are arranged, and thus, the electronic components are mounted.

Description

technical field [0001] The present invention relates to a printed wiring board on which soldering work using lead-free solder can be reliably performed. Background technique [0002] When mounting electronic components on the surface of a printed board, flow soldering or reflow soldering is generally performed. The flow welding is performed in the following manner. By dipping the printed board into the surface of a solder bucket containing liquid solder that has been heated and melted, the printed board to which the electronic components have been incorporated is brought into contact with the melted solder, thereby fixing the electronic components to the printed board by soldering. The reflow soldering is performed in the following manner. Milky solder containing paste flux is printed on a printed board in advance, and the printed board with electronic components placed on the surface of this milky solder is heated with hot air in a reflow furnace so that the milky solder ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K3/34
CPCH05K3/341H05K3/3452H05K2203/0264H05K2201/10106H05K1/182H05K1/11
Inventor 胜田英嗣
Owner KK TOKAI RIKA DENKI SEISAKUSHO