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Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board

A photosensitive composition and photosensitivity technology, applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc.

Inactive Publication Date: 2012-06-20
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] At present, for the purpose of forming permanent patterns such as solder resist, even for the above-mentioned film type, there is no photosensitive composition with good sensitivity and excellent survivability , a photosensitive film, a permanent pattern forming method using the above photosensitive composition, and a printed circuit board patterned by the above permanent pattern forming method, so further improvement and development are desired

Method used

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  • Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board
  • Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board
  • Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern and printed board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0725] The present invention will be described more specifically through examples below, but the present invention is not limited thereto.

Synthetic example 1

[0727] 159 g of 1-methoxy-2-propanol was added to a 1000 mL three-necked flask, and heated to 85° C. under a nitrogen stream. A solution of 63.4 g of benzyl methacrylate, 72.3 g of methacrylic acid, and 4.15 g of V-601 (Wako Pure Chemicals) was added dropwise thereto in 159 g of 1-methoxy-2-propanol over 2 hours. After completion of the dropwise addition, it was heated for 5 hours to make it react. Next, heating was stopped to obtain a copolymer of benzyl methacrylate / methacrylic acid (30 / 70 mol% ratio).

[0728] Next, 120.0 g of the above-mentioned copolymer solution was transferred to a 300 mL three-necked flask, 16.6 g of glycidyl methacrylate and 0.16 g of p-methoxyphenol were added, and stirred to dissolve. After dissolution, 3.0 g of triphenylphosphine was added, heated to 100° C., and addition reaction was carried out. After confirming the disappearance of glycidyl methacrylate by gas chromatography, heating was stopped. 1-Methoxy-2-propanol was added to prepare a so...

Synthetic example 2～27

[0733] In order to obtain the desired polymer compound, except that benzyl methacrylate, methacrylic acid and glycidyl methacrylate in Synthesis Example 1 are changed into suitable arbitrary monomers, the others are the same as Synthesis Example 1, and prepared respectively Polymer compounds 2 to 27 shown in Tables 1 to 5.

[0734] [Table 1]

[0735]

[0736] [Table 2]

[0737]

[0738] [table 3]

[0739]

[0740] [Table 4]

[0741]

[0742] [table 5]

[0743]

[0744] In Tables 1 to 5, *1 represents a mixture of the structure represented by the following structural formula (a) and the structure represented by (b) (the mixing ratio is unknown), and *2 represents the structure represented by the following structural formula (c) and ( d) Mixing (mixing ratio unknown).

[0745] [chem 34]

[0746] Structural formula (a)

[0747] Structural formula (b)

[0748] [chem 35]

[0749] Structural formula (c)

[0750] Structural formula (d)

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Abstract

A photosensitive composition that by the use of an oxime derivative and a specified sensitizer, realizes good sensitivity and excellent raw storability; a relevant photosensitive film; a method of forming a permanent pattern with the use of the photosensitive composition; and a printed board having a permanent pattern formed according to the permanent pattern forming method. There is provided a photosensitive composition comprising a binder, a polymerizable compound, a photopolymerization initiator and a thermal crosslinking agent, wherein in the exposure and development of formed photosensitive layer, the variation coefficient of the formula log10(E1 / E0) falls within +-0.3. In the formula, E1 refers to the minimum energy of light for use in exposure that in the process of superimposing aphotosensitive layer on a substratum, hermetically sealing the same in an atmosphere of 24 DEG C 60% RH, and storing it at 40 DEG C for 3 days, followed by exposure and development, causes no change to the thickness of area to be exposed of the photosensitive layer after the exposure and development, and E0 refers to the corresponding minimum energy of light for use in exposure after storage in dark place at 24 DEG C for 30 min.

Description

technical field [0001] The present invention relates to a photosensitive composition capable of efficiently forming high-precision permanent patterns (protective film, interlayer insulating film, solder resist pattern, etc.), a photosensitive film, a permanent pattern forming method using the photosensitive composition, and A permanently patterned printed circuit board is formed by the permanent pattern forming method. Background technique [0002] Conventionally, when forming a permanent pattern such as a solder resist, a photosensitive film in which a photosensitive composition is applied to a support and dried to form a photosensitive layer is used. As the manufacturing method of the above-mentioned permanent pattern, the above-mentioned photosensitive film is laminated on a substrate such as a copper-clad laminate plate forming the above-mentioned permanent pattern to form a laminate, the above-mentioned photosensitive layer on the laminate is exposed, and the above-ment...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/031C08F2/50C08F290/12G03F7/004G03F7/26H01L21/027H05K3/28H05K3/46
CPCC08F2/50H05K3/287C08F290/12C08F290/00G03F7/031G03F7/027G03F7/028
Inventor 池田贵美藤田明德
Owner FUJIFILM CORP
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