Structure and method for packing ink-jet printhead and cartridge structure of ink-jet printhead

Abstract

The invention discloses a package structure of an inkjet printing head, a packaging method and a caddy structure of the inkjet printing head. The package structure of the inkjet printing head comprises a soft circuit board which is equipped with a first printing circuit layer on a first plane and a second printing circuit layer on a second plane respectively. The first printing circuit layer comprises a plurality of first conductors, and the second printing circuit layer comprises a plurality of second conductors. A plurality of conductive objects are arranged in the soft circuit board, one end of the soft circuit board is arranged on the first plane and electrically connected to the corresponding first conductor, and the other end is arranged on the second plane and electrically connected to the corresponding second conductor. At least one wafer accommodation area runs through the soft circuit board. An inkjet printing head wafer which is equipped with a plurality of wafer contact pads is arranged in the corresponding wafer accommodation area and electrically connected with the first conductors. The invention further provides the packaging method of the inkjet printing head, and the caddy structure of the inkjet printing head which uses the package structure. The package structure can meet requirements of wide printing and increasing printing speed without adding area of the soft circuit board.

Description

technical field [0001] The invention relates to an inkjet printing head structure, in particular to an inkjet printing head packaging structure for wide-format printing, a packaging method and an inkjet printing head cartridge structure using the same. Background technique [0002] The inkjet printhead (ink jet printhead) chip is connected with the printer through the flexible circuit board, providing its function of transmitting and receiving control printing signals, so as to eject ink to print documents or patterns. [0003] see figure 1 Shown is a schematic diagram of the packaging structure of an inkjet print head chip in the prior art. In the prior art, the inkjet print head chip 120 is packaged on a flexible circuit board 110 . When the prior art is required to meet the requirements of wide-format printing and increased printing speed, the size of the inkjet print head chip 120 must be increased to meet the above requirements. However, increasing the size of the in...

AI Technical Summary

Problems solved by technology

Therefore, the size and specifications of the inkjet printhead die are quite limited

[0005] The packaging structure and packaging method of the above-mentioned existing inkjet print head still have inconvenience and defects in product structure, packaging method and use, and need to be further improved urgently

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

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