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46results about How to "Improve outstanding performance" patented technology

Input device of capacitive touchpad

InactiveCN101339470AImprove the problem that the moving distance is relatively shortImproved Capacitive Sensing DifferenceInput/output processes for data processingPolyesterCapacitance
The invention relates to a capacitance type touch control panel input device for user holding to produce capacitance inductor of capacitance type touch control panel. The capacitance type touch control panel comprises: a conductive pen head, made of conductive material for contacting capacitance type touch control panel; a pen body, one end of which connects or deploys conductive pen head; and a connection part, between pen head and pen body, for user holding capacitance inductor producing a capacitance type touch control panel with conductive pen head. The invention comprises conductive pen head, pen body of relative big area for contacting user palm and for user holding, and finger touchable pen body; conductive pen head and connection part can be scarf joint in pairs. The conductive pen head can uses polyester as inside filler of pen head, uses metal material as clad, or uses mixed polyester and metal material as pen head conductive material to increase contact surface with capacitance type touch control panel, thereby resolving problem of relative short moving distance resulting from relative large area of finger for contacting capacitance type touch control panel, and capacitance inducted variation resulting from sweating of hand.
Owner:ELAN MICROELECTRONICS CORPORATION

Earphone device

The invention relates to an earphone device which includes a case, a loudspeaker unit and a microphone. The case has a sound out part; the loudspeaker unit is set in the case which includes a vibrating diaphragm and a sound leading hole, the vibrating diaphragm is set between the sound out part and the sound leading hole; the microphone is set in the case and shields the sound leading hole; wherein, the loudspeaker unit receives sound wave come from an ear canal, the microphone receives sound wave through the sound leading hole. A structure design of the earphone device that the sound leading hole is set in the loudspeaker unit makes sound wave generated from the ear canal transmitting to the microphone in the earphone device, so extended setting microphone on the main body as prior art is not needed. The microphone in the earphone device can receive sound wave come from the ear canal, and prevent the microphone from being disturbed by external environment in communication.
Owner:MERRY ELECTRONICS CO LTD

Touch pad and position sensing method for the same

The invention relates to a touch panel and a position detection method for the touch panel. The touch panel includes a substrate and a single-layer circuit layout formed on the substrate. The single-layer circuit layout includes a plurality of conductive lines, and each conductive line has a resistance value that gradually changes with the distance from one end thereof. The position detection method is used to detect a contact position of a contact object on a touch panel equipped with multiple conductive lines, and the parts of the conductive lines arranged at the position detection positions are arranged at intervals in a first dimension direction, along a first dimension. The two-dimensional directions extend in parallel, and the unit resistance value of the conductive lines extending in parallel along the second dimensional direction changes with the distance from one end of the conductive lines. The method includes: calculating the resistance and capacitance of each conductive line The sum of the products, and the second dimension direction coordinate value of the contact position is judged according to the calculated sum. The present invention has the advantage of lower cost through simple wiring, and can use one-dimensional wiring detection lines to achieve two-dimensional position positioning, which is very practical.
Owner:ELAN MICROELECTRONICS CORPORATION

Method and control system for altering lamp luminous color

The invention relates to a method changing lamp lightening color and a control system thereof; wherein, the lamp lightening color changing method comprises as followings: (a) control commands carrying different mixing proportion colors are selected on an operating interface; (b) the control commands are transmitted to the lamps and stored into the memory of the lamps; and (c) lamps regulate and control the lamp lightening colors according to the control commands of the step (b). The control system comprises a control device, an operating interface, a display module, a storing module, a first transmitting module, at least a lamp, a color changing lamp, a second transmitting module, a memory and a driving module; wherein, the operating interface is used for selecting to generate the control commend carrying the different mixing proportion colors; the display module is used for previewing the color mixing result; the storing module is used for storing the control commend; and the first transmitting module is used for transmitting the control commends; at least one lamp is controlled by the control device to change colors; the second transmitting module is used for receiving the control commands; the memory is used for storing the control commands; and the driving module is used for regulating and controlling the lightening colors of the color-changing lamps according to the control commands. The method can lead the users to change the lightening colors of the lamps, increase the living interests and create the atmosphere, and extend the lamp application range.
Owner:EVERBRIGHT OPTECH

Stackable semiconductor encapsulation construct for multi-cylinder body

The invention relates to a polycylinder stackable semiconductor packaging structure. The structure mainly comprises a wafer carrier, a wafer and a plurality of downwards convex block groups, wherein the wafer carrier has a plurality of switchover pads on an upper surface and a plurality of external pads on a lower surface; the wafer is arranged on and is electrically connected with the wafer carrier; the downwards convex block groups are correspondingly arranged on the external pads, and each downwards convex block group connected with each external pad consists of a plurality of conducting cylinders; and a solder filling gap is arranged between adjacent conducting cylinders of the same downwards convex block group. The stackable semiconductor packaging structure is used to increase welding area and perplex the shape of a welding interface, thereby achieving high durability of welding spots and reducing the growing possibility of cracks. In addition, the convex block group arranged on each external pad has the solder filling gap, solder can be filled and stored in the convex block group, so that a plaque does not extrude the solder to cause bridging short circuit even when inclined or warped; therefore, the structure is particularly suitable for practical use.
Owner:POWERTECH TECHNOLOGY

Network telephone connecting system and network telephone connecting method

The invention relates to a Voice over Internet Protocol (VOIP) connecting system and VOIP connecting method, which reaches voice communication through Internet. The VOIP linking system includes an interaction type switching system, a contact database, a called party data selective circuit, a VOIP signal converter and a VOIP signal transmitter. The contact database stores the contact man data required by users. The called party data selective circuit, according to a called party code and a user incoming call identification code, takes out a corresponding answering account. The account is a telephone number or an electronic communication account. The present invention can dial users at PC terminals through a small amount of representative numbers, indoor telephones or mobile phone users, accordingly expanding the use range of traditional network telephone. In addition, the VOIP connecting system can automatically connect related accounts of the called party, the users do not need to enter their own called account themselves (such as skype account), thereby increasing the convenience of use.
Owner:田种楠

Integrated circuit packaging construction and multi-layer conducting wire holder used for it

The present invention relates to an IC packaging and its multi-layer conductor frame. The IC packaging has been defined with a wire-bonded region which mainly includes a multi-layer conductor frame with pins, a wafer, even numbers of welding lines in this region and at least an electric-transferred component. At least one of these pins carries a transferred finger which is insulating to the corresponding pin and does not cover inner terminal of the pin. The electric-transferred component has at least one part which is formed outside the wire-bonded region, and the transferred finger is connected to one pin which is not under the transferred finger. The shortest distance between staggered welding lines can be added, or staggered points of these welding lines can be reduced, thus staggered short circuit of welding lines can be avoided during colloid sealing.
Owner:CHIPMOS TECH INC

Semiconductor packaging structure with common type wafer holder

The present invention relates to a semiconductor packaging structure with a common wafer bearing seat. A lead frame has the common wafer bearing seat and a plurality of pins. The common wafer bearing seat has a plurality of mould flow through holes communicating with each other upwards and downwards, which can be arranged in an array or arranged around the circumference. The wafers with different size can be installed on the common wafer bearing seat, and is wrapped with a mould sealing glue body. The number for the mould flow through holes uncovered by the wafer or the communication area also can be increased following the contract changing for the size of the wafer, which makes the upper mould flow or lower mould flow with higher flow speed having separated flowing effect, so the installing on the same guide line frame for the wafer with different size can reach the balance for the upper and lower mould flows.
Owner:CHIPMOS TECH INC

Semiconductor encapsulation construction

The invention discloses a semiconductor seal structure, comprising a substrate which is provided with an upper surface and a plurality of steel pits formed on the upper surface, the upper surface is defined with a wafer arrangement area, the steel pits are arranged on the blank area of a line outside the wafer arrangement area and do not penetrate the substrate; a wafer which is arranged on the upper surface of the substrate and in the wafer arrangement area; a seal body which is formed on the upper surface of the substrate to seal the wafer; thereby being capable of increasing the seal compound area and the wet air invading paths under the situation of not changing the appearance of a product and reaching the effect that wet air resistance is not peeled off from heat resistance.
Owner:POWERTECH TECHNOLOGY

Semiconductor packaging construction with weld crack restraint ring

InactiveCN101369559APrevent cracks from spreadingAvoid the problem of electrical open circuitSemiconductor/solid-state device detailsSolid-state devicesSemiconductor packageEngineering
The invention is related to a semiconductor encapsulating structure, comprising: a wafer carrier that includes an upper surface and a lower surface, wherein the lower surface is provided with plural first conduction pads; a water which is arranged and electrically connected with the wafer carrier; and plural turriform projections that are correspondingly arranged on these first conduction pads, for welding outwards, each of the turriform projections includes at least a first crack suppression ring which is parallel to these first conduction pads and which is used for suppressing expansion of the welding crack. The invention can effectively prevent the expansion of crack at solder-welding interfaces and avoid the issue of electric breaking as the external terminals provided at the wafer carrier are the turriform projections and at least one crack suppression ring is contained in the invention. Furthermore, the invention also can increase welding fixation strength in order to achieve high production durability. The invention is particularly suitable for a stacked structure and extremely practicable owing to effective suppression of the crack expansion at micro-contact welding sites.
Owner:POWERTECH TECHNOLOGY

Handheld equipment capable of switching signal receiving modes

The invention relates to handheld equipment capable of switching signal receiving modes, comprising a telescopic antenna, a telecommunication receiving and sending module, a satellite signal module and a switching circuit, wherein the telescopic antenna can extend to a first length and withdraw to a second length; the telecommunication receiving and sending module receives and sends a first frequency signal when the telescopic antenna extends to the first length and receives and sends a second frequency signal when the telescopic antenna extends to a second length; the satellite signal module receives a satellite signal when the telescopic antenna extends to the second length; the switching circuit receives the switching signal; the switching circuit is electrically connected with the telescopic antenna; when the telecommunication receiving and sending module is electrically connected with the telescopic antenna, the telescopic antenna is adjusted to the first length to receive and send the first frequency signal and adjusted to the second length to receive and send the second frequency signal, or when the switching signal is obtained, the telescopic antenna is electrically connected with the satellite signal module, and the telescopic antenna is adjusted to the second length so that the satellite signal module receives the satellite signal. The handheld equipment can receive various frequency signals by one antenna so that different function modules receive and send different frequency signals to increase the practicability.
Owner:INVENTEC APPLIANCES CORP

Navigation system

The invention relates to a navigation system, which comprises a navigation device. The navigation device comprises a shell, a display screen, a GPS receiver, a processor, a remote terminal control device and a connecting device, wherein the display screen is arranged inside the shell and used for displaying image pictures; the GPS receiver is arranged inside the shell and used for receiving GPS signals; the processor is arranged inside the shell, coupled with the GPS receiver and the display screen, and used for locating according to the GPS signals, and processing and controlling the displayscreen to display a program code of a user interface; the remote terminal control device is used for generating an input signal corresponding to a user input; and the connecting device is used for establishing data connection between the remote terminal control device and the navigation device to transmit the input signal to the navigation device. By additionally adding the remote terminal control device and the connection device used for establishing the data connection between the remote terminal control device and the navigation device, the invention enhances use convenience and safety of the navigation device in automobiles. The remote terminal control device can be installed on an automobile conveniently to provide various operations, and the navigation device can be operated safely and easily.
Owner:MITAC INT CORP

Sliding structure and electronic device applied by same

The invention relates to a sliding structure and an electronic device applied by the same. The sliding structure is matched with a shell and comprises a plate body, a column body and a limit piece, wherein at least one part of the plate body is exposed out of the shell, the column body is connected with the plate body and is provided with a concave part; the limit piece is provided with a bolt andat least one clip, the bolt is inserted into the concave part, and the clip is clamped at the periphery of the column body. The electronic device comprises a shell, a plate body, a column body and alimit piece, wherein the shell is provided with a groove, at least one part of the plate body is exposed out of the shell, the column body is connected with the plate body and provided with a concavepart, the column body is arranged in the groove in a penetrating way and slides in the groove, the limit piece is provided with a bolt and at least one clip, the bolt is inserted in the concave part,and the clip is clamped at the periphery of the column body. On the premise of not increasing the complexity of the manufacture procedure, the sliding structure is stably connected to the shell of theelectronic device by using a structural fixing mode, the structure reliability can be improved without increasing the cost incidence of the product, the excellent rate of the manufacture procedure can be improved, and the product cost can be lowered.
Owner:INVENTEC CORP

Replaceable shock damper and bicycle frame therewith

The invention relates to a bicycle frame with a replaceable damper and the damper. The bicycle frame with the replaceable damper comprises at least a frame bar with a joint and a damper that can be detachably clamped between the frame bars; the damper comprises an elastic body that can be detachably arranged on the joint of the frame bar; the elastic body is provided with two separated opposite slabby elastic spring plate parts. With the structural design of being detachably arranged on the frame bar and the characteristic of elastic deformation of the spring plate parts of the damper, a hard frame and the frame bar are endowed with the vibration-proof effects without increasing weight; besides, common heavy gas and oil cylinder dampers with fussy parts can be replaced, thus reducing the weight of common damping frames and adjusting the whole damping performance through changing the positions and number of the damper.
Owner:ADVANCED INT MULTITECH CO LTD

Semiconductor package substrate increasing static dissipation capability

InactiveCN101226919AIncrease dissipation areaEnhanced Static Dissipative CapabilitySemiconductor/solid-state device detailsSolid-state devicesSolder maskSemiconductor package
The invention relates to a semiconductor package substrate capable of reinforcing static dissipating ability, comprising a dielectric layer, a plurality of pins, a plurality of first static guide circuits, a plurality of second guide circuits and a solder mask. The first static guide circuits and the second static circuits are formed in a plurality of static dissipating areas of the dielectric layer, the static dissipating areas are in electric insulating neighbored arrangement and are exposed out of the solder mast, further the first static guide circuits are connected with a part of pins, thereby reinforcing the static dissipating ability of the substrate in manufacture procedure.
Owner:CHIPMOS TECH INC

Chip carrier socket

The invention relates to a chip carrier socket. The chip carrier socket can accommodate a chip, and comprises a pedestal, a floating platform, a plurality of probes and a fixing device. The pedestal can be connected to a chip tester; the floating platform is arranged on the pedestal and comprises a positioning plane which is provided with a plurality of positioning holes; the probes are arranged in the positioning holes; and the fixing device is used for fixing the chip. In the chip carrier socket, the chip can be flatly attached to the positioning plane so that a contact point of the chip is consistent with the contact condition of the probes; therefore, the testing stability can be increased; and meanwhile, the chip carrier socket can fix the chip, so the chip can avoid being pulled out by a chip pick-and-place head, and the chip carrier socket is quite practical.
Owner:KING YUAN ELECTRONICS

Chip carrier socket

The invention relates to a chip carrier socket. The chip carrier socket can accommodate a chip, and comprises a pedestal, a floating platform, a plurality of probes and a fixing device. The pedestal can be connected to a chip tester; the floating platform is arranged on the pedestal and comprises a positioning plane which is provided with a plurality of positioning holes; the probes are arranged in the positioning holes; and the fixing device is used for fixing the chip. In the chip carrier socket, the chip can be flatly attached to the positioning plane so that a contact point of the chip isconsistent with the contact condition of the probes; therefore, the testing stability can be increased; and meanwhile, the chip carrier socket can fix the chip, so the chip can avoid being pulled outby a chip pick-and-place head, and the chip carrier socket is quite practical.
Owner:KING YUAN ELECTRONICS

Purification device

InactiveCN101653619AImprove the efficiency of catalysisPromote oxidationGaseous substancesRadiationBiomedical engineeringCoating
The invention relates to a purification device, which comprises a plurality of shells, a plurality of guide ring discs, a plurality of purification lamp tube units and a plurality of layers of first plating film. The guide ring discs are arranged in the corresponding shells respectively, each guide ring disc forms a disc surface totally in a helical shape, and the each guide ring disc and the corresponding shell define a passage; the purification lamp tube units are arranged in the corresponding shells respectively, and axially run through the corresponding guide ring discs; and because the first plating films are distributed on the corresponding disc surfaces, when a fluid substance flows into the passage of each shell, the helical disc surface of the guide ring disc enables the fluid substance and the first plating film on the disc surface to have large-area contact and longer residence reaction time so as to improve the efficiency of catalytic action between the liquid or gas substance and the first plating film and improve the effect on purification.
Owner:第一环保能源科技股份有限公司

Luminous diode base structure possessing horizontal heat diffusion member

The invention relates to a light emitting diode seat structure with a horizontal thermal diffusion member, comprising a seat body and a horizontal thermal diffusion member. The seat body is a co-fired multilayer ceramic base material with a first surface and a second surface, and the first surface and the second surface are respectively provided with a first heat conducting layer and a second heat conducting layer. Heat conducting bodies which are longitudinally and transversely mutually interlaced and connected are arranged in the seat body, and the heat conducting bodies are respectively in heat-conducting combination with the first heat conducting layer and the second heat conducting layer. The horizontal thermal diffusion member is provided with a first contact surface and a second contact surface, wherein the first contact surface and the second contact surface are in heat-conducting combination. By the longitudinal and transverse arrangement of the heat conducting bodies inside the seat body, heat energy generated by the light emitting diode can be acceleratively conducted to the horizontal thermal diffusion member, and then the heat energy is conducted out of the light emitting diode seat body via the horizontal thermal diffusion member. The light emitting diode seat structure combining the seat body and the horizontal thermal diffusion member can enable the seat structure to have better heat conducting efficiency.
Owner:钜亨电子材料元件有限公司

Luminous diode with jointing construction and its system

The invention relates to a light-emitting diode with a connecting structure and a system thereof. The light-emitting diode element with the connecting structure is provided with a light source body on a bearing base, meanwhile the light-emitting diode can be provided with a plurality of connecting pins. A light-emitting diode can be directly bonded with the adjacent light-emitting diode using the connecting pins, thereby allowing a plurality of light-emitting diodes to be connected with each other in series or in parallel and forming a light-emitting diode system, and the light-emitting diodes are combined to present different forms in two-dimension (2D) or three-dimension (3D) according to the need of the designer.
Owner:FIDIN TECH

Electronic mechanism with battery device

The invention relates to an electronic mechanism with a battery device, which comprises a circuit board, an antenna and a battery device, wherein the circuit board is provided with a first grounding end and a second grounding end; the antenna is provided with a grounding end which is electrically connected with the first grounding end; the battery device comprises a battery body, a battery coating piece, a guard wire circuit board and a battery connector, the periphery of the battery body is coated by one surface of the battery coating piece, one surface of the battery coating piece exceeds a distance from the periphery, the other surface of the battery coating piece is in contact with the second grounding end, and the guard wire circuit board is positioned on the distance which exceeds the periphery of the battery body and is connected with the battery coating piece; and the battery connector is used for connecting the guard wire circuit board and the first grounding end. The second grounding end not only can share the redundant electric charge of the partial battery body, but also can share the redundant electric charge of the partial antenna, and the grounding total area is increased, therefore, the coupling effect can be greatly reduced.
Owner:INVENTEC APPLIANCES CORP

Driver circuit and power source converter comprising the driver circuit

The invention relates to a drive circuit and a power converter containing the drive circuit. The power converter comprises a main switch controlled by a driving signal, a main transformer receiving an input power supply in a switching way by the main switch, and a switching circuit which outputs a synchronizing signal and comprises a switch used for determining the receive status of an external connection load power supply; the drive circuit includes a dead pole time controller and an opposite phase generator; wherein, the dead pole time controller is provided with a second switch and a fourth switch, and the fourth switch is controlled by the synchronizing signal to control the conducting state of the second switch; the opposite phase generator is provided with a first switch and a fifth switch which are controlled by the driving signal, and the fifth switch is controlled by the first and the second switches to output a switching signal that has the opposite phase to the driving signal, and the switching circuit is controlled; furthermore, dead pole time spacing is kept between the synchronizing signal and the switching signal. The invention can actively modify the switching signal, ensures the phenomenon of reverse current not to occur, leads the circuit to be synchronous and improves the drive capability by using the drive circuit.
Owner:LITE ON TECH CHANG ZHOU CO LTD +1

Rhythmic game device

The invention relates to a rhythmic game device comprising a first knocking device and a second knocking device. When knocking mutually, the first knocking device and the second knocking device respectively generate a first sensing signal and a second sensing signal. When being synchronously generated, the first sensing signal and the second sensing signal can be judged to be a knocking event by a processing module, and the processing module processes a game unit according to the knocking event, therefore, a user can use more playing actions to play the rhythmic game device so as to increase the game interest.
Owner:INTERNATIONAL GAMES SYSTEM

System and method for photolithography in semiconductor manufacturing

The present invention is relates to a method for photolithography in semiconductor manufacturing which includes providing a substrate for a wafer and providing a mask for exposing the wafer. The wafer is exposed by utilizing a combination of high angle illumination and focus drift exposure methods. The photolithography using the method of conforming high-angle illumination and a method of focus drift exposure, can reduce the proximity effect and increase the focus depth.
Owner:TAIWAN SEMICON MFG CO LTD

Driver circuit and power source converter comprising the driver circuit

The invention relates to a drive circuit and a power converter containing the drive circuit. The power converter comprises a main switch controlled by a driving signal, a main transformer receiving an input power supply in a switching way by the main switch, and a switching circuit which outputs a synchronizing signal and comprises a switch used for determining the receive status of an external connection load power supply; the drive circuit includes a dead pole time controller and an opposite phase generator; wherein, the dead pole time controller is provided with a second switch and a fourth switch, and the fourth switch is controlled by the synchronizing signal to control the conducting state of the second switch; the opposite phase generator is provided with a first switch and a fifthswitch which are controlled by the driving signal, and the fifth switch is controlled by the first and the second switches to output a switching signal that has the opposite phase to the driving signal, and the switching circuit is controlled; furthermore, dead pole time spacing is kept between the synchronizing signal and the switching signal. The invention can actively modify the switching signal, ensures the phenomenon of reverse current not to occur, leads the circuit to be synchronous and improves the drive capability by using the drive circuit.
Owner:LITE ON TECH CHANG ZHOU CO LTD +1

Structure and method for packing ink-jet printhead and cartridge structure of ink-jet printhead

InactiveCN101439613AReduce areaRealize electrical interconnectionPrintingContact padEngineering
The invention discloses a package structure of an inkjet printing head, a packaging method and a caddy structure of the inkjet printing head. The package structure of the inkjet printing head comprises a soft circuit board which is equipped with a first printing circuit layer on a first plane and a second printing circuit layer on a second plane respectively. The first printing circuit layer comprises a plurality of first conductors, and the second printing circuit layer comprises a plurality of second conductors. A plurality of conductive objects are arranged in the soft circuit board, one end of the soft circuit board is arranged on the first plane and electrically connected to the corresponding first conductor, and the other end is arranged on the second plane and electrically connected to the corresponding second conductor. At least one wafer accommodation area runs through the soft circuit board. An inkjet printing head wafer which is equipped with a plurality of wafer contact pads is arranged in the corresponding wafer accommodation area and electrically connected with the first conductors. The invention further provides the packaging method of the inkjet printing head, and the caddy structure of the inkjet printing head which uses the package structure. The package structure can meet requirements of wide printing and increasing printing speed without adding area of the soft circuit board.
Owner:INT UNITED TECH

Multi-dimensional pulse-width modulating method and multi-dimensional pulse-width modulating signal generator

The invention relates to a multi-dimensional pulse-width modulating method and a multi-dimensional pulse-width modulating signal generator. The multi-dimensional pulse-width modulating method can be used for sampling inputted signals to generate the pulse-width modulating signal including at least one pulse modulation. The energy contained in the pulse-width modulating signal is expressed by a data bit combination which uses at least three of the control bits including a pulse-width modulating control bit, a current control bit, a voltage control bit and a repetitive-rate control bit for adjusting the energy contained in the pulse-width modulating signal. The multi-dimensional pulse-width modulating signal generator comprises a pulse encoding modulator, a multi-dimensional pulse-width modulating controller and a multi-dimensional pulse-width modulating driver. The multi-dimensional pulse-width modulating method can improve the resolution of the pulse-width modulating signal, and the multi-dimensional pulse-width modulating signal generator can overcome the defect of the insufficient resolution of the pulse-width modulating signal, thus the invention is practical.
Owner:ELAN MICROELECTRONICS CORPORATION

Material separating device

The invention relates to a material separating device of a test device, which comprises a blockage arm, a first clamping jaw set, a first swing arm set, a second clamping jaw set, a second swing arm set, a first forward pushing block, a second forward pushing block, a third swing arm set, a down pressing seat and a power source, wherein the blockage arm is arranged at the front end of the material separating device and controls the entrance of a first element to be detected; the first clamping jaw set is arranged in back of the blockage arm and used for clamping the first element to be detected; the first swing arm set is arranged in back of the first clamping jaw set and used for controlling and clamping; the second clamping jaw set is arranged at the other side of the front end of the material separating device, positioned in back of the first clamping jaw set and used for clamping a second element to be detected; the second swing arm set is arranged in back of the second clamping jaw set; the first forward pushing block is arranged in back of the first swing arm set and connected with the second forward pushing block, and pushes the first clamping jaw set to move forward; the second forward pushing block controls the motion of the blockage arm; the third swing arm set is arranged in back of the first forward pushing block, and pushes the second and first forward pushing blocks forward; the down pressing seat is arranged above the first, second and third swing arm sets; and the power source is arranged above the down pressing seat and connected with the down pressing seat, and drives the down pressing seat. Because the material separating device has only one power source and the power source drives all elements to separate materials, the material separating speed canbe increased and the volume of a feeding mechanism can be reduced.
Owner:KING YUAN ELECTRONICS
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