The application relates to the technical field of
printed circuit board hot-press forming equipment, and particularly discloses a layered positioning and pressing device for high-density
interconnection printed circuit boards, which comprises a rack, a pressing rack, a pressing mechanism, positioning pins, a floating
assembly, a pneumatic mechanism and a guiding mechanism. The pneumatic mechanism comprises air holes, a plugging plug and an air
pipe. The plugging plug closes the air holes during pressing, forms a negative pressure space after cooling and pressurized gas is output during resetting. The application can adsorb the circuit board for a short time at the beginning of mold opening, avoids the circuit board from being taken up with the pressing mechanism, and separates the circuit board through
positive pressure flexible assistance. Meanwhile, the positioning pins can be lowered to avoid interference and damage during plate taking, and the pressing stability is improved.