Metal packaging structure and preparation method, packaging method of display panel, display device

A metal packaging and display panel technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as equipment downtime, waste of adhesive film and metal film, and poor peeling

Active Publication Date: 2019-03-08
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the prior art, due to the good adhesion between the protective film and the adhesive film, it is easy to cause the upper protective film to lift part or all of the adhesive film when peeling off, resulting in poor peeling.
This will not only cause waste of adhesive film and metal film, but also cause abnormal shutdown of equipment and delay in production
As a result, production costs and yields are negatively affected, and capacity improvements are limited

Method used

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  • Metal packaging structure and preparation method, packaging method of display panel, display device
  • Metal packaging structure and preparation method, packaging method of display panel, display device
  • Metal packaging structure and preparation method, packaging method of display panel, display device

Examples

Experimental program
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Effect test

Embodiment 1

[0046] Such as figure 1 As shown, Embodiment 1 of the present invention provides a method for preparing a metal packaging structure, the preparation method comprising:

[0047] Step S1, providing a metal film, the metal film has opposite first surface and second surface;

[0048] Step S2, forming a silane film on the first surface; the surface of the silane film away from the metal film has active groups;

[0049] Step S3, attaching the first surface formed with the silane film to the adhesive layer, so that the active groups react with the adhesive layer to combine.

[0050] It should be noted that, the specific materials of the metal film and the adhesive layer mentioned above can follow the conventional materials of the metal packaging process in the prior art.

[0051] Wherein, since the above-mentioned metal packaging structure is specifically used for the surface-mounted display substrate, considering that the substrate substrate of the display substrate is usually mad...

Embodiment 2

[0091] Embodiment 2 of the present invention provides a metal packaging structure formed by the preparation method of Embodiment 1 above. The metal packaging structure includes: a metal film having opposite first and second surfaces; Silane film on the surface, the surface of the silane film away from the metal film has active groups (refer to Figure 4 shown); an adhesive layer attached to the first surface attached to the silane film, the adhesive layer can react with the above-mentioned active groups to form a covalent bond.

[0092] In this way, the silane film disposed on the first surface of the metal film is covalently bonded to the surface of the metal film, so that the silane film can be more firmly attached to the first surface of the metal film. The surface of the silane film away from the metal film is designed to have active groups, which react with a large number of dormant reactive groups in the adhesive layer to form covalent bonds. The silane film located bet...

Embodiment 3

[0097] Embodiment 3 of the present invention provides a packaging method for a display panel. The packaging method includes: providing the metal packaging structure in any one of the above-mentioned Embodiment 2; attaching the side of the metal packaging structure that is away from the metal film to the display panel. panel.

[0098] The above packaging method specifically includes: peeling off the protective film attached on the side of the adhesive layer far away from the metal film in the metal packaging structure to expose the side of the adhesive layer far away from the metal film; attaching the side of the adhesive layer far away from the metal film to the display panel .

[0099] Such as Figure 6 As shown, the specific packaging process flow is: peel off the protective film 21 below the adhesive layer 20, and attach it to the first surface of the metal film 10 formed with a silane film (not shown in the figure) by a hot pressing process; Machine) in the equipment, pe...

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PUM

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Abstract

The invention provides a metal packaging structure and preparation method, a packaging method of a display panel, and a display device, and relates to the field of display technology, which can significantly improve the adhesion between the metal film and the adhesive layer, and avoid the need to protect the protective film on the surface of the adhesive layer. The adhesive film is lifted up during peeling to reduce production costs and improve production yield. The preparation method includes: providing a metal film, the metal film has an opposite first surface and a second surface; forming a silane film on the first surface; the surface of the silane film far away from the metal film has active groups a group; attaching the first surface formed with the silane film to the adhesive layer, so that the active groups react with the adhesive layer to combine.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a metal packaging structure and a preparation method, a packaging method of a display panel, and a display device. Background technique [0002] As a mainstream packaging technology for large-size OLED (Organic Light-Emitting Display, organic electroluminescent display) displays, surface packaging technology has been widely used in existing production processes. The existing process routes mainly include the following two types: [0003] 1. Metal packaging process [0004] That is, the metal film and the OLED display panel (or backplane) are adhered together with a pre-cured adhesive film, and then the adhesive film is cured through a hot pressing process, thereby encapsulating the entire surface of the OLED display panel through the metal film . [0005] 2. Dam & Filler process [0006] That is, apply high-viscosity Dam glue (cofferdam filling glue) on the frame part of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52
CPCH10K50/844H10K50/8423H10K50/8426H10K71/00
Inventor 李杰威殷川熊先江齐忠胜屈丽桃
Owner BOE TECH GRP CO LTD
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