Semiconductor packaging construction with weld crack restraint ring

Abstract

The invention is related to a semiconductor encapsulating structure, comprising: a wafer carrier that includes an upper surface and a lower surface, wherein the lower surface is provided with plural first conduction pads; a water which is arranged and electrically connected with the wafer carrier; and plural turriform projections that are correspondingly arranged on these first conduction pads, for welding outwards, each of the turriform projections includes at least a first crack suppression ring which is parallel to these first conduction pads and which is used for suppressing expansion of the welding crack. The invention can effectively prevent the expansion of crack at solder-welding interfaces and avoid the issue of electric breaking as the external terminals provided at the wafer carrier are the turriform projections and at least one crack suppression ring is contained in the invention. Furthermore, the invention also can increase welding fixation strength in order to achieve high production durability. The invention is particularly suitable for a stacked structure and extremely practicable owing to effective suppression of the crack expansion at micro-contact welding sites.

Description

technical field [0001] The invention relates to a three-dimensional stacking technology of a semiconductor package structure, in particular to a semiconductor package structure with a welding crack suppression ring, which can be applied to a package-on-package module (POP) structure of a high-density package stack. Background technique [0002] With the development trend of miniaturization of electronic products, the area available for setting semiconductor packaging structures on the surface of the printed circuit board is getting smaller and smaller. Therefore, there is a three-dimensional stacking technology for semiconductor packaging structures, which is to stack a plurality of semiconductor packaging structures together to form a Package-On-Package module (POP), in order to meet the small surface bonding area and high-density components. set requirements. However, soldering defects are a major problem during the bonding process of the package stack. The fine pitch of ...

AI Technical Summary

Problems solved by technology

[0005] However, it becomes more sensitive to stress resistance. When stress is generated at the soldering interface of the stud bumps 130, cracks will propagate along the inclined continuous sidewalls 131 of the stud bumps 130, resulting in electrical failure. open circuit

[0006] It can be seen that the above-mentioned existing semiconductor packaging structure obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem

Images