Integrated circuit suitable for various encapsulation modes
A technology of integrated circuits and packaging modes, which is applied in the field of integrated circuits with various packaging modes, and can solve the problems that the development and production costs of microchips cannot be effectively saved.
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[0133] Specific embodiments are listed below to illustrate the content of the present invention in detail, and the accompanying drawings are used as an auxiliary description. The symbols mentioned in the description are reference symbols.
[0134] Referring to FIG. 3, an integrated circuit 200 according to an embodiment of the present invention is suitable for packaging in multiple modes, such as single microchip packaging, multiple microchip packaging, and so on. The integrated circuit 200 includes a core circuit 210, a plurality of bonding pads 230, 250, a selection circuit 270, and a control circuit 290.
[0135] Here, the core circuit 210 refers to the circuit part used to provide the main core functions of the integrated circuit. Generally, the core circuit 210 has one or more signal input / output terminal signals. In this embodiment, in order to be applicable to multiple packaging modes, the signal input terminal is coupled to the selection circuit 270, and the selection circ...
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