Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Stamping process of double-folded-edge back plate structure

A double edge folding and back plate technology is applied in the field of stamping technology, which can solve the problems of increased cost and easy scraping of foreign objects, and achieves the effect of solving energy consumption and production cost, and processing reasonable and efficient.

Active Publication Date: 2021-02-12
冠鸿光电科技(武汉)有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As an important part of the ultra-thin flat-panel display, the backplane has a hemming structure around it. If a single hemming structure is used, it is easy to scrape foreign matter when the backplane is assembled with the middle frame of the display. At the same time, the current stamping process is basically Multiple stamping devices are used to stamp the back plate. For example, four holes need to be punched on the back plate, either two holes on the same side, or four holes together, which increases the cost of the stamping production process. For this reason, Propose a stamping process for double-folded back panel structure

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stamping process of double-folded-edge back plate structure
  • Stamping process of double-folded-edge back plate structure
  • Stamping process of double-folded-edge back plate structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0023] refer to Figure 1-5 , a stamping process of a double-folded backboard structure, comprising the following steps: S1, embossing, embossing in the middle area of ​​the backboard forming to form a convex hull structure, and simultaneously drawing holes on the backboard around the surroundings, One circle is a semicircular drawing bead; S2, plane shaping, partial trimming, use a cutting device to cut part of the edge of the backboard; S3, trimming, punching, use a cutting device to trim the backboard Cut the outer dimensions of the backplane, and then use the punching device to punch holes around the screw holes on the backplane; S4, bend, form and position the b...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a stamping process of a double-folded-edge back plate structure. The stamping process comprises the following steps that S1, protruding is conducted, specifically, protruding is conducted on a middle forming area of a back plate to form a convex hull structure, meanwhile, hole drawing is conducted on the back plate at the periphery, and a circle of semicircular deep drawingribs are arranged on the periphery; S2, plane shaping and partial edge cutting are conducted, specifically, a cutting device is used for conducting cutting treatment on part of the edge of the back plate; S3, edge cutting and punching are conducted, specifically, the cutting device is used for conducting cutting treatment on the outer dimension of the back plate, and then a punching device is used for conducting punching treatment on the positions of screw holes in the periphery of the back plate; and S4, bending and positioning convex point forming are conducted, specifically, a bending device is used for bending the edge of the back plate by a certain angle, and then the folded edge is bent again. According to the stamping process of the double-folded-edge back plate structure, throughimplementation of the whole process of the stamping process of the double-folded-edge back plate structure, double folded edges are used for replacing a traditional single-folded-edge structure machining process, and machining of the whole back plate is more reasonable and efficient.

Description

technical field [0001] The invention relates to the technical field of punching technology, in particular to a punching technology of a double-folded backboard structure. Background technique [0002] Flat-panel display is a high-tech developed rapidly in recent years. It has many advantages: thin and light, low voltage, no X-ray radiation, no flicker, no static electricity, long service life, etc. Therefore, flat-panel display is widely used in military and civilian fields have a very wide range of uses. [0003] As an important part of the ultra-thin flat-panel display, the backplane has a hemming structure around it. If a single hemming structure is used, it is easy to scrape foreign matter when the backplane is assembled with the middle frame of the display. At the same time, the current stamping process is basically Multiple stamping devices are used to stamp the back plate. For example, four holes need to be punched on the back plate, either two holes on the same side...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00B21D35/00
CPCB23P15/00B21D35/001B21D35/002Y02E10/50
Inventor 周宏江艳
Owner 冠鸿光电科技(武汉)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products