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Substrate conveyance device and vertical heat treatment equipment

A heat treatment device and substrate conveying technology, which is applied to conveyor objects, transportation and packaging, electrical components, etc., can solve the problem of reducing the accuracy of stress conveying, and achieve the effect of preventing deflection

Inactive Publication Date: 2009-05-27
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, it is assumed that the above-mentioned deflection will cause stress or decrease in transfer accuracy (the size and space of the deflected part at the center of the wafer need to be considered)

Method used

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  • Substrate conveyance device and vertical heat treatment equipment
  • Substrate conveyance device and vertical heat treatment equipment
  • Substrate conveyance device and vertical heat treatment equipment

Examples

Experimental program
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Embodiment Construction

[0039] The best mode for carrying out the present invention will be described in detail below based on the drawings. figure 1 2( a ) is a front view schematically showing a substrate transfer device, and FIG. 2( b ) is a side view thereof. image 3 is a vertical cross-sectional view of the support portion, Figure 4 is the bottom view of the support.

[0040] In these figures, 1 is a vertical heat treatment apparatus (semiconductor manufacturing apparatus), and this vertical heat treatment apparatus 1 includes a frame body 2 forming an outer contour, and is arranged above the frame body 2 for accommodating a substrate such as a thin disk. A vertical heat treatment furnace 3 for performing a predetermined treatment such as CVD treatment on a semiconductor wafer w with a large diameter (300 mm in diameter or 400 to 450 mm in diameter). This heat treatment furnace 3 includes a vertically long treatment vessel such as a reaction tube 5 made of quartz whose lower part is opened a...

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PUM

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Abstract

Warping of a substrate during conveyance in the central portion thereof due to its own weight is suppressed as a substrate of super large diameter is employed. A substrate conveyance device (18) comprises a supporting section (17) which is moved to above a large diameter substrate (w), and an upper catching mechanism provided at the supporting section (17) and supporting the substrate (w) while catching the peripheral portion thereof from above. The supporting section (17) is provided with a noncontact suction holding portion consisting of a suction hole and a blowing hole. The noncontact suction holding portion blows gas against the central portion of the upper surface of the substrate (w) and forms an air layer so that the central portion of the substrate (w) is not bent thus suction holding the substrate (w) by noncontact.

Description

technical field [0001] The present invention relates to a substrate transfer device and a vertical heat treatment device, and particularly relates to a technique for suppressing deflection of a substrate when transferring a large-diameter substrate with an upper clamp. Background technique [0002] In the manufacture of semiconductor devices, there are various heat treatments such as oxidation, diffusion, CVD, annealing, etc. on substrates such as semiconductor wafers. Vertical heat treatment equipment for heat treatment (semiconductor manufacturing equipment). [0003] This vertical heat treatment device includes: a heat treatment furnace with a furnace mouth in the lower part; a cover body that seals the furnace mouth; a holder that is arranged on the cover body to hold a plurality of wafers at predetermined intervals in the up and down direction through an annular support plate (also referred to as a wafer boat); a lifting mechanism that moves the above-mentioned cover b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677
CPCH01L21/6838H01L21/68707H01L21/67098H01L21/67766H01L21/67778
Inventor 中尾贤加藤寿萩原顺一
Owner TOKYO ELECTRON LTD
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