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Substrate temperature adjusting-fixing devices

A technology for fixing substrates and substrates, which is applied in the fields of electric solid-state devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., and can solve the problem that the substrate 303 cannot be heated to a predetermined temperature, it takes a lot of time, and the resistance heater 307 is damaged, etc. question

Inactive Publication Date: 2009-06-24
SHINKO ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the apparatus 300 for adjusting and fixing the substrate temperature according to the conventional art, there arises a problem that the entire substrate 303 cannot be heated to a predetermined temperature.
[0010] In addition, since the heat of the base body 305 is easily transferred to the bottom plate 302, there arises a problem that it takes a lot of time to heat the substrate placement surface 305A to a predetermined temperature.
[0011] In addition, although it is conceivable to heat the substrate placement surface 305A to a predetermined temperature by applying a high voltage to the resistance heater 307, in this case, a high current flows into the circuit of the resistance heater 307, thereby causing a possibility that the resistance heater 307 is damaged. question

Method used

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  • Substrate temperature adjusting-fixing devices
  • Substrate temperature adjusting-fixing devices
  • Substrate temperature adjusting-fixing devices

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0042] figure 2 is a cross-sectional view showing an apparatus for adjusting and fixing the temperature of a substrate according to a first embodiment of the present invention.

[0043] Such as figure 2 As shown, the device 10 for adjusting and fixing the substrate temperature includes: an electrostatic chuck 11 , a bottom plate 12 and power supplies 14 to 17 .

[0044] The electrostatic chuck 11 includes: a substrate 21 , an electrostatic electrode 22 , a resistance heater 23 , and electrodes 31 to 38 . The base body 21 is adhered to the base plate 12 . The base body 21 includes a substrate placement surface 21A for placing the substrate 20 thereon. For example, ceramics can be used as material for the base body 21 . In the case of using ceramics as the material of the base body 21 , the base body 21 is formed, for example, by firing a plurality of laminated green sheets (not shown). In addition, for example, a glass substrate or a semiconductor substrate (for example,...

no. 2 example

[0078] Figure 6 is a cross-sectional view showing an apparatus for adjusting and fixing the temperature of a substrate according to a second embodiment of the present invention.

[0079] Such as Figure 6 As shown, except that the bottom plate 12 provided in the apparatus 10 for adjusting and fixing the substrate temperature according to the first embodiment is replaced with the bottom plate 81 and an inert gas supply line 82 and an inert gas supply device 83 are additionally provided, according to the second embodiment The apparatus 80 for adjusting and fixing the temperature of the substrate of the example has the same configuration as the apparatus 10 for adjusting and fixing the temperature of the substrate.

[0080] In addition to the construction of the base plate 12 (see figure 2 ), the bottom plate 81 has the same structure as the bottom plate 12 except that an inert gas supply line 85 is further provided.

[0081] An inert gas supply line 85 is embedded in the sole...

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Abstract

A substrate temperature adjusting-fixing device 10 includes an electrostatic chuck 11 which is provided with a base body 21 having a substrate placement surface 21A for placing s substrate 20 thereon, an electrostatic electrode 22 embedded in the base body 21, and a resistance heater 23 embedded in the base body 21 to heat the substrate 20; and a base plate 12 which is provided with a cooling mechanism 46 for cooling the electrostatic chuck 11 and supports the electrostatic chuck 11, in which a heat insulation portion 47 is provided in a base plate body 45 at a portion located between the cooling mechanism 46 and the electrostatic chuck 11.

Description

technical field [0001] The present invention relates to an apparatus for adjusting and fixing the temperature of a substrate, and more particularly, the present invention relates to an apparatus for adjusting and fixing the temperature of a substrate provided with an electrostatic chuck having a base body and embedded in the base body so as to heat the substrate resistance heater. Background technique [0002] In a manufacturing apparatus such as a coating apparatus for forming a coating on a substrate such as a glass substrate or a semiconductor substrate, or an etching apparatus for patterning a coating formed on a substrate, adjusting and fixing the substrate is provided temperature device, to adjust the temperature of the substrate adsorbed and fixed on the substrate to a predetermined temperature (see figure 1 ). [0003] figure 1 is a cross-sectional view showing an apparatus for adjusting and fixing the temperature of a substrate according to a conventional techniq...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/683
CPCH01L2924/0002H01L21/6831H01L21/67109H01L2924/00H01L21/683H01L23/34H01L21/02
Inventor 米仓宽儿山智昭玉川晃树
Owner SHINKO ELECTRIC IND CO LTD