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Radiating plate for semiconductor package and electroplating method therefor

A technology for heat sinks and semiconductors, which is applied in the directions of semiconductor devices, semiconductor/solid-state device manufacturing, and semiconductor/solid-state device components, etc., can solve problems such as weakening the connection force between the substrate 200 and the foot portion 170 , etc.

Active Publication Date: 2013-05-22
SHINKO ELECTRIC IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, if gold is erroneously plated on the foot portion 170 of the heat sink 100 , wherein the foot portion 170 is bonded to the substrate 200 with an adhesive, the force applied between the substrate 200 and the foot portion 170 will be weakened. connection force

Method used

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  • Radiating plate for semiconductor package and electroplating method therefor
  • Radiating plate for semiconductor package and electroplating method therefor
  • Radiating plate for semiconductor package and electroplating method therefor

Examples

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no. 1 example

[0053] will refer to Figure 3A to Figure 3E The first embodiment will be explained.

[0054] Such as Figure 3E As shown, the cooling plate 10 according to the first embodiment is square when viewed from a plan view, and its overall shape is roughly a cuboid. Such as Figure 3A As shown, a concave portion 15 is provided on the central portion of the inner bottom surface of the cooling plate 10, and a foot portion 17 is also provided on the peripheral portion of the bottom surface. A stepped portion 18a which will constitute a mask region 19a (discussed below) is provided on the entire periphery of the inner wall portion 18 formed between the bottom surface of the foot portion 17 and the inner bottom surface 16 . The stepped portion 18 a is provided on the inner wall portion 18 and arranged between the first inner wall forming the outer periphery of the inner bottom surface 16 and the second inner wall forming the inner periphery of the foot portion 17 . As shown in the to...

no. 2 example

[0070] Next, refer to Figure 4A to Figure 4E A second embodiment of the present invention is explained.

[0071] The heat dissipation plate 10 according to the second embodiment has a square shape when viewed from a top view, and its overall shape is substantially a cuboid. Such as Figure 4A As shown, a recess 15 is provided in the central portion of the bottom surface of the heat sink 10, and a foot portion 17 is also provided on the peripheral portion of the bottom surface. A sloped portion 18b forming a mask area 19a (discussed below) is provided on the entire periphery of the inner wall portion 18 disposed between the bottom surface of the foot portion 17 and the inner bottom surface 16 . The inclined portion 18b is inclined such that the opening area of ​​the above-described inclined portion 18b gradually becomes larger from the inner bottom surface 16 side toward the foot portion 17 side.

[0072] Metals having excellent thermal conductivity such as aluminum and cop...

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PUM

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Abstract

A heat radiating plate for a semiconductor package has a concave portion provided on a surface of the heat radiating plate, having an inner bottom face and an inner wall portion, a stepped portion provided on the inner wall portion of the concave portion and a plating portion covering an entire surface of the inner bottom portion of the concave portion.

Description

technical field [0001] The present invention relates to a heat dissipation plate for a semiconductor package (package), which has a concave portion in a central portion. More specifically, the present invention relates to a heat sink for a semiconductor package in which the entire bottom portion of the heat sink is plated. Background technique [0002] In a semiconductor package on which a semiconductor element is mounted, a heat sink is thermally connected to the back surface of the semiconductor element to dissipate heat generated by the semiconductor element. FIG. 1 shows an example of a semiconductor package having a semiconductor element 300 mounted on a substrate 200 with a heat dissipation plate 100 thermally connected to the backside of the semiconductor element 300 . The heat sink 100 is made of materials with high thermal conductivity such as copper and aluminum. A recess 150 is provided in the heat dissipation plate 100 , and the semiconductor element 300 is pla...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/36H01L21/48
CPCH01L2224/73253H01L23/04H01L2924/15311H01L2924/16195H01L2924/01078H01L23/3675H01L2924/01079H01L23/3735H01L2224/16H01L23/42H01L2924/00014H01L2924/16152H01L2224/05599H01L23/36H01L2224/05568H01L2224/05573
Inventor 根来修司
Owner SHINKO ELECTRIC IND CO LTD
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