Check patentability & draft patents in minutes with Patsnap Eureka AI!

Printed circuit board and impedance guarantee method of printed circuit board

A technology of printed circuit boards and test pieces, applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve problems such as product cost and productivity impact

Inactive Publication Date: 2009-06-24
KK TOSHIBA
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will have a big impact on product cost and productivity

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board and impedance guarantee method of printed circuit board
  • Printed circuit board and impedance guarantee method of printed circuit board
  • Printed circuit board and impedance guarantee method of printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Various embodiments of the present invention will be described with reference to the drawings. According to one embodiment of the present invention, a printed circuit board includes: a test strip portion having an impedance guarantee test strip provided to a plurality of signal layers as a reference of the layer; and having at least one layer among the plurality of signal layers Among them, the transmission line requiring impedance guarantee has an impedance determination factor different from that of the test piece formed by the test piece part, in which the impedance of the transmission line is guaranteed according to the known impedance determination factor of the transmission line and the measured value of the test piece.

[0026] Embodiments of the present invention will be described with reference to the drawings. In practical applications, impedance guarantees are performed on various signal layers formed on a multilayer printed circuit board. To simplify the de...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

According to one embodiment, a printed circuit board includes a coupon portion having, for each of a plurality of signal layers, an impedance guarantee coupon as a reference for the layer, and a product portion having, in at least one of the plurality of signal layers, a transmission line requiring impedance guarantee having an impedance decision factor different from the coupon formed in the coupon portion, wherein an impedance of the transmission line is guaranteed on the basis of a known impedance decision factor of the transmission line and a measured value of the coupon.

Description

technical field [0001] An embodiment of the present invention relates to a printed circuit board constituted by a transmission line requiring impedance guarantee, and to an impedance guarantee method of the printed circuit board. Background technique [0002] Recently, the transmission rate between circuit elements in electronic devices has been increasing, and the impedance control technology of transmission lines or connections between elements is an important factor to maintain the stability of signal transmission through the transmission lines. [0003] In a high-frequency signal transmission line, by controlling the impedance (high-frequency impedance) of the transmission line, the signal can be transmitted with maximum energy. [0004] In the electronic equipment described above, circuit elements that process high-frequency signals are mounted on a printed circuit board, so that it is necessary to control the impedance of the printed circuit board. [0005] Control of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00G01R27/02
CPCH05K1/0266H05K1/0237H05K2201/09781H05K3/0052H05K2201/09236H05K2201/09127
Inventor 古贺裕一
Owner KK TOSHIBA
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com