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Heat radiator

A radiator and heat dissipation fin technology, which is applied in semiconductor devices, electric solid state devices, cooling/ventilation/heating transformation, etc., can solve the problems of inconvenient assembly, time-consuming, and unsuitable for mass production.

Inactive Publication Date: 2009-07-01
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is extremely inconvenient and time-consuming to assemble the heat sinks one by one on the base by using thermal conductive glue or welding, which is obviously not suitable for mass production. Therefore, it is hoped that this type of heat sink will be further improved

Method used

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  • Heat radiator
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Experimental program
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Embodiment Construction

[0012] see figure 1 and figure 2 , the heat sink includes a number of heat dissipation fins 100 combined together, in this embodiment, the heat dissipation fins 100 are irregular in shape, and each heat dissipation fin 100 is arranged in parallel at intervals, and it is convenient to form a flow channel between each heat dissipation fin 100 The air flow circulates to enhance the heat exchange between the cooling fins 100 and the environment. Each cooling fin 100 includes a flat body 10, and a front edge 20 and a rear edge 22 respectively bent from opposite sides of the body 10, namely the front side and the rear side. The directions of the sides 20 and 22 are the same. In this embodiment, the two folded sides 20 and 22 are bent upwards, and the cooling fins 100 are stacked up and down to form a heat sink. A fastening structure 30 is formed on each folded edge 20 , 22 to connect the cooling fins 100 as a whole. A fastening structure 30 is formed on the right end of the fron...

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PUM

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Abstract

A radiator includes a plurality of radiating fins which are piled and arranged back and forth. Every radiating fin includes a body and at least one folding edge bent from the body; at least one fastening structure is arranged on the folding edge and includes a lug extending outwards from the folding edge and an accommodating hole formed on the folding edge; the lug is accommodated in the accommodating hole of an adjacent radiating fin; one side of the lug, which closes to the accommodating hole, slantingly extends to the inside of the body of the radiating fin, so as to form a buckle slab; and the buckle slab is buckled against the body of the adjacent radiating fin. Therefore, the fastening structure combines the radiating fins fixedly into a whole, the structure is simple, and the assembly is convenient.

Description

technical field [0001] The invention relates to a heat sink, in particular to a heat sink used for heat dissipation of electronic components. Background technique [0002] With the continuous development of electronic technology, the heat generated per unit volume of electronic components increases accordingly. However, the traditional aluminum extruded or die-cast radiators are limited by the limited heat dissipation area of ​​machining, and the heat exchange area with the surrounding air is not large. Even with fans, they cannot dissipate heat in time and fully. Thermal requirements of electronics manufacturers. [0003] Therefore, the industry improves the traditional heat sink to increase the overall heat dissipation area of ​​the heat sink. Thereby, a combined heat sink formed by stacking a plurality of metal cooling fins is produced. This type of heat sink includes a plurality of cooling fins and a base. One end of each cooling fin forms a long folded edge, and the l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/34H01L23/40
Inventor 严成林周万益
Owner FU ZHUN PRECISION IND SHENZHEN