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Pattern structure of circuit board

A patterning, circuit board technology, applied in the directions of printed circuit components, electrical components, magnetic/electric field shielding, etc., can solve the problems of increasing the area of ​​the circuit board 100 and the difficulty of wiring the circuit board 100, so as to meet the needs of diversified products Effect

Active Publication Date: 2011-11-16
UNIMICRON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the former may greatly increase the area of ​​the circuit board 100, and at the same time increase the difficulty of layout of the circuit board 100, or the latter may lead to electrical changes in other circuit designs.

Method used

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  • Pattern structure of circuit board
  • Pattern structure of circuit board
  • Pattern structure of circuit board

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Embodiment Construction

[0043] Figure 2A is a schematic cross-sectional view of a patterned structure of a circuit board according to an embodiment of the present invention, Figure 2B to Figure 2D All are schematic cross-sectional views of patterned structures of circuit boards in other different embodiments of the present invention. It should be explained in advance that the patterned structure of the circuit board of the present invention can be one layer of circuit structure of a multilayer circuit board with two layers, three layers, four layers or more than four layers, and Figure 2A to Figure 2D The patterned structure of the circuit board can be used as the outermost circuit of the circuit board or the circuit structure of any layer inside the circuit board.

[0044] In detail, the circuit board can choose to complete the patterned structure of the present invention as the outermost circuit layer by layer-up method, stacking method or other methods after the inner layer circuit process is ...

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Abstract

A patterned structure of circuit board comprises a dielectric layer, a first conductor pattern and a second conductor pattern. The dielectric layer is provided with a surface, a first intaglio pattern and a second intaglio pattern. The first intaglio pattern and the second intaglio pattern are positioned on the surface. The first conductor pattern is configured on the first intaglio pattern, and the second conductor pattern is configured on the second intaglio pattern. The material of the first conductor pattern is different from the material of the second conductor pattern. The surface of the first conductor pattern and the surface of the second conductor pattern are substantially trimmed to the surface of dielectric layer.

Description

technical field [0001] The present invention relates to a circuit board, and in particular to a patterned structure having a plurality of conductor patterns of different materials in the same layer of circuit. Background technique [0002] The public in modern society has widely used electronic devices such as cellular phones, notebook computers, desktop computers and personal digital assistants (Personal Digital Assistant, PDA). Among the necessary parts of these electronic devices, in addition to electronic components such as chips and passive components, circuit boards carrying and configuring these chips and passive components are also very important parts. [0003] figure 1 It is a schematic cross-sectional view of a known circuit board. figure 1 The circuit board 100 shown is a common four-layer wiring board (four-layers wiring board), which is composed of two wiring layers 110a and 110b, a ground layer 120, a power layer 130 and three dielectric layers 140a, 140b, 1...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K9/00
Inventor 余丞博黄瀚霈余丞宏
Owner UNIMICRON TECH CORP
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