Benzoxazine-containing formulations polymerizable/curable at low temperature
A technology of benzoxazine and catalyst, applied in the field of novel polymerization catalysts and compositions containing at least the catalyst, capable of solving the problems of strong acid unfavorable polymerization results in actual performance, cured materials with poor chemical resistance and physical properties, etc.
Active Publication Date: 2013-03-06
HENKEL KGAA
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Problems solved by technology
[0006] However, in practical applications, such strong acids may also be detrimental to the final polymerization results and their practical properties
For example, it may occur that the chemical resistance and physical properties of the cured material deteriorate
Method used
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Experimental program
Comparison scheme
Effect test
Embodiment 1
[0118] As stated, 2.5 mol% of manganese catalyst 1a, relative to benzoxazine fraction 2, was mixed to obtain a homogeneous mixture, about 10 mg of the mixture was analyzed by DSC.
[0119]
Embodiment 2
[0121] Iron catalyst 1b and benzoxazine monomer 2 were mixed to obtain a homogeneous mixture. About 10 mg of the mixture was analyzed by DSC.
[0122]
Embodiment 3
[0124] Cobalt catalyst 1c and benzoxazine monomer 2 were mixed to obtain a homogeneous mixture. About 10 mg of the mixture was analyzed by DSC.
[0125]
[0126] Table 1
[0127]
[0128] In each case, T H10％ Below about 140°C.
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The present invention relates to a catalyst, which is an organic component with electron withdrawing substituents and to compositions with such catalyst and at least one benzoxazine component, and the use of such compositions in adhesives, sealants and coatings.
Description
technical field [0001] The present invention relates to novel polymerization catalysts and compositions comprising at least this catalyst, said catalyst being a fluorine-containing organic component and at least one benzoxazine component, and the use of such compositions in adhesives, sealants and coatings the use of. Background technique [0002] Electronic devices, such as circuit boards, semiconductors, transistors and diodes, are often coated with materials such as epoxy for protection. Such coating materials are often cured by heating on the surface of the electronic device. But electronic devices are often sensitive to heating, and excessive heating can adversely affect the device's performance. Another problem in practice is that a large amount of energy is required for heating and / or the time required for the polymerization and curing reaction is too long. [0003] In addition, if the coating material shrinks or expands significantly due to heating, the device it ...
Claims
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IPC IPC(8): C08F4/74C08F4/80C08G61/12C08L65/00C09D165/00C09J165/00H01L23/29
CPCC08G73/02C08F10/00H01L2924/12044C08G61/122H01L23/293H01L2924/0002C08F4/74C08F4/80H01L2924/00
Inventor 须藤淳远藤健安德烈亚斯·塔登雷纳·舍恩菲尔德托马斯·胡佛
Owner HENKEL KGAA