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Method and system for evaluating object

An object, area technology, applied in the field of automatic detection

Inactive Publication Date: 2014-06-11
APPL MATERIALS ISRAEL LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This hybrid comparison process has the disadvantages of chip-to-chip comparisons and unit-to-unit comparisons described above

Method used

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  • Method and system for evaluating object
  • Method and system for evaluating object
  • Method and system for evaluating object

Examples

Experimental program
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Embodiment Construction

[0024] A method, system, and computer program product for evaluating objects, such as wafers, masks, or reticles, during or after fabrication for micromachining, flat panel displays, microelectromechanical (MEM) devices, and the like.

[0025] According to an embodiment of the invention sub-regions are defined. Each sub-region includes a repeating array of structural elements. The repeating array of structural elements is surrounded by at least one set of non-repeating regions. Non-repeating regions belonging to a single set of non-repeating regions are ideally identical to each other. Non-repeating regions are arranged in a repeating fashion. Instead of chip-to-chip comparisons, the methods, systems and computer program products apply other comparisons. This comparison is performed between image information of multiple non-overlapping regions belonging to subregions immediately adjacent to each other (usually belonging to the same chip). This type of comparison is more re...

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PUM

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Abstract

The invention provides a method, a system and a computer program product for evaluating objects. The method for evaluating objects comprises the following steps: (1) obtaining the image of a region ofan object, wherein the region comprises repetitive structure elements of a plurality of arrays which are at least partly surrounded by at least a group of non-repetitive regions, the non-repetitive r egions belonging to the single group of non-repetitive region are ideally identical, and the non-repetitive regions are arranged in a repetitive mode; (2) and responding to the comparison between the image information of a first sub-region and the image information of a second sub-region close to the first sub-region to provide an evaluation result, wherein the first sub-region comprises repetitive structure elements of a first array and a first non-repetitive region, and the second sub-region comprises repetitive structure elements of a second array and a second non-repetitive region.

Description

technical field [0001] The present invention generally relates to the field of automatic inspection of objects such as wafers, masks or reticles for microfabrication, flat panel displays, microelectromechanical (MEM) devices and the like. Background technique [0002] Over the past few decades, defect inspection for detecting microscopic manufacturing defects has become a standard part of micromachining manufacturing processes, especially for semiconductor wafers. [0003] Various inspection techniques, suitable for finding multiple types of defects with high potential, are often applied at multiple steps in the semiconductor manufacturing process. The economics of inspection have been significant and inspection technology is generally considered to have contributed significantly to the dramatic growth in the field of semiconductor wafer fabrication that occurred in the 1990s. [0004] Inspection systems are used in a number of different applications including the process o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/88G06F19/00
Inventor 多德新·尼尔·本-戴维加特·维里德
Owner APPL MATERIALS ISRAEL LTD
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