Photoresist removing machine station and photoresist removing process

Abstract

The invention provides a photoresist removing machine station and a photoresist removing process. The photoresist removing machine station comprises a heater, a wafer carrier, a motor and a height control unit, wherein the wafer carrier is provided for a wafer to make vertical displacement relative to the heater; the motor is electrically connected with the wafer carrier and the height control unit respectively; and the height control unit is used for controlling the wafer to stop on at least three positions. The photoreist removing process comprises the following steps: positioning the wafer at a bearing position by utilizing the wafer carrier when the wafer enters the photoresist removing machine station; moving the wafer carrier to move the wafer to a temperature-reduction position; and moving the wafer carrier to move the wafer to a process position. The invention can avoid cracking of photoresist caused by overheating of the wafer, thereby improving the qualification rate.

Description

technical field [0001] The invention relates to a photoresist removal machine and a photoresist removal process. Background technique [0002] see Figure 1A , Figure 1B , Figure 1A It is a schematic diagram of the wafer carrier of the traditional photoresist removal machine in the loading position, while Figure 1B A schematic diagram of the wafer carrier at the process position of a conventional photoresist removal tool. The photoresist removal machine 10 is used to remove the photoresist on the wafer 20. The traditional photoresist removal machine 10 includes a wafer carrier 11, a heater 12, a motor 13 and a temperature controller 14. When the wafer 20 enters the photoresist removal machine 10, the wafer 20 is positioned at the carrying position (such as Figure 1A The position shown), at this time, the distance between the wafer 20 and the heater 12 is 2 mm, so that the wafer 20 is transferred from the external machine (not shown in the figure) to the photoresist rem...

AI Technical Summary

Problems solved by technology

After the wafer 20 enters the photoresist removal machine 10, the heater 12 begins to heat up under the influence of the temperature controller 14. Since the process time must be shortened as much as possible, the heater 12 will heat up rapidly. Tool 11 will move vertically, and wafer 20 will move to process position (such as Figure 1B position shown), because the wafer carrier 11 in the traditional photoresist removal machine 10 can only make the wafer 20 stay at the carrying position and the process position, and the rapid temperature rise will easily cause the photoresist The temperature in the removal machine 10 is higher than the process temperature, so when the wafer 20 is heated at a high temperature, the distance between the wafer carrier 11 and the heater 12 is too close, and the photoresist burst (photoresistance) of the wafer 20 may occur. popping)

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