58results about How to "Improve process pass rate" patented technology

The invention discloses a manufacturing method of an appearance part, comprising the following steps that: a first mold is provided, wherein the first mold is provided with a mold cavity, and then the surface of the mold cavity is provided with grains; then a second mold is provided, and then a trans-printing film is arranged between the first mold and the second mold; and finally, a trans-printing technique is executed so as to form the appearance part.

A method for manufacturing a display substrate. The method is applied to manufacture a transflective liquid crystal display. The method steps at least include: forming an active element and a capacitance structure on the substrate. A planarization layer is formed above the active components and capacitor structures. The planar layer is subjected to a photolithographic etching process using a mask with various light-transmitting regions, so as to simultaneously form different structural features on the planar layer.

A method for improving wafer cleaning efficiency and process pass rate, wherein the method for improving wafer cleaning efficiency is to firstly deposit several kinds of process particles on a test wafer. Then a cleaning process is performed to clean the test wafer. Afterwards, the test wafer is scanned to confirm which process particles have been completely removed and which process particles remain on the test wafer. Then, a result of scanning the test wafer is used to evaluate the cleaning capability of the cleaning process. Then, modify the parameters of the cleaning process to improve the efficiency of the cleaning process.

A method and an apparatus for manufacturing a glass structure are described, which includes the following steps. A glass substrate is provided. A ceramic precursor layer is formed to cover a surface of the glass substrate. A laser annealing treatment is performed on the ceramic precursor layer to crystallize the ceramic precursor layer into a ceramic film.

The invention provides a stator structure of a molding electrical machine for a washing machine, which comprises a stator iron core insulating piece and an terminal part, wherein the terminal part and the stator iron core insulating piece are respectively to be a separated part and are connected with each other into a whole body in the manner of inserting, fastening, bonding or molding. The middle of the terminal part is provided with a plane which is named as a middle plane of the terminal part, the middle plane of the terminal part is provided with a protecting hole for protecting an enameled wire, and the enameled wire is arranged in the protecting hole of the enameled wire when the terminal part is molded, so that the terminal part can be directly molded without arranging a conventional cover for protecting the terminal part, the material and the time can be saved, and the hidden trouble that the enameled wire is crushed by the conventional structure can be avoided. Furthermore, a certain height difference exists between a groove at a place where the enameled wire is inserted and the middle plane, so that a waterproof material can not be fed into or covered on the end part of an electric connecting coil, and the defective product of the stator of the electrical machine since a molding material is fed into the end part of the electric connecting coil can be reduced.

The invention relates to a method for reducing dust in a clean room, a storage system and a transfer device thereof. The storage system includes rails, transfer devices, storage racks and spoilers. The transfer device can travel on the track, and it includes a base, a bearing body, a transmission part and a deflector. The carrying body is configured on the base. The transmission member is used to drive the base to move, and has a characteristic length D. The deflector has a plane and a guide slope, wherein the plane is arranged on the first height H, and 0.1D≤H≤9D. There is an angle θ between the guide slope and the plane, and the angle θ corresponds to the characteristic length D. The storage rack is arranged on one side of the track and has a storage space. The spoiler baffle is located below the storage space and is arranged on the second height h, and 0.025D≤h≤2.5D. The invention can prevent the dust or particles raised by the airflow caused by the moving of the transfer device from polluting the items on the storage rack.

The invention discloses an encapsulation structure and a manufacturing method thereof. The encapsulation structure comprises a metal layer, a composite layer of a non-conductor inorganic material and an organic material, a sealant, a wafer, a circuit layer structure and an insulating protection layer. The composite layer of non-conductive inorganic material and organic material is arranged on the metal layer. The sealant is combined on the composite layer of non-conductive inorganic material and organic material. The chip is embedded in the encapsulant, and the chip has a plurality of electrode pads. The wiring layer structure is formed on the encapsulant and the wafer. The circuit layer structure includes at least one dielectric layer and at least one circuit layer, the dielectric layer has a plurality of conductive blind holes, the circuit layer is located on the dielectric layer, and the bottommost circuit layer is electrically connected to the electrode pad through the conductive blind holes. The insulation protection layer is formed on the circuit layer structure. The insulating protection layer has a plurality of openings, so that part of the surface of the circuit layer structure is exposed in the openings. The invention can strengthen the overall structural strength to prevent warpage.

The present invention relates to a pad pattern repair apparatus. The present invention provides an apparatus for repairing defects in pad electrodes equipped for applying signals to one of multiple substrates, comprising a stage into the reference surface of which the substrate is loaded; a chamber where a first exhaust, a shield gas outlet, and a second exhaust are formed sequentially in the lower surface of the chamber with respect to a laser light emission hole being equipped on the stage and moving to the defect position of the pad electrode and having structure to discharge purifying gas and raw gas in the middle of the hole; and a clamp being installed on the stage and supporting the opposite surface of a substrate adhered closely to the reference surface, the gap between the substrate and the lower surface of the chamber varying in the inside and outside of the lower surface of the chamber. A pad pattern repair apparatus according to the present invention maintains the pressure in the area where repairing a defect is carried out at a constant level, improving a process yield.

This invention relates to cooling liquid injection process, which comprises the following steps: a, setting one sealed element into cooling liquid injection entrance; then under one negative environment injecting the liquid into projection tube to facilitate cooling liquid higher than cooling liquid mouth; then injecting sealed parts into injection mouth sealing; then injecting cooling liquid into cooling liquid. This invention provides one cooling liquid injection clamper into projection tube.