Lead frame for leadless encapsulation, encapsulation construction and manufacture method thereof
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., and can solve problems such as area limitations
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[0016] 2( a ) to 2 ( e ) are schematic diagrams of various manufacturing steps of the leadless package structure of the present invention. First, the metal plate 11 covered with the adhesive tape 12 is provided, and the metal plate 11 can be selected from the group consisting of copper, aluminum, copper-aluminum alloy, aluminum alloy and mixtures thereof. As shown in FIG. 2( b ), multiple depressions 132 are formed by stamping on the upper surface of the metal sheet 11 , and a plurality of protrusions 131 are produced on the lower surface of the metal sheet 11 bonded with the adhesive tape 12 . Then, the metal plate 11 is formed into a plurality of connected chip holders 14 and a plurality of separated pins 13 by photolithography, and the plurality of pins 13 are respectively arranged in a plurality of through holes 141 around each chip holder 14, As shown in Figure 2(c). Each die pad 14 and surrounding pins 13 are regarded as a package unit 181 on the lead frame 18 .
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