Package structure and manufacturing method thereof
A technology of packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as insufficient strength and warpage of the overall structure, and achieve improved reliability and improved reliability. Process pass rate, warpage prevention effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0021] A number of implementations of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known and commonly used structures and elements will be shown in a simple and schematic manner in the drawings.
[0022] Figure 1A ~ Figure 1G It is a cross-sectional view of each step of the manufacturing method of the package structure 18 according to an embodiment of the present invention. First, if Figure 1A As shown, a carrier board 10 is provided, and the carrier board 10 includes a support layer 100 having two opposite surfaces 100A, 100B, a peeling layer 102 disposed on the opposing two...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com