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Pouring gate structure of mould in APG process

A technology of molds and gates, which is applied in the field of gates, can solve the problems of easy sink marks, scrapped insulation products, and difficulty in processing, and achieve the effects of delaying part curing, reducing product deformation, and improving pass rate

Inactive Publication Date: 2009-11-11
SHANGHAI ROX ELECTRIC
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Problems solved by technology

[0003] Insulation parts of medium and high voltage electrical equipment are generally made of thermosetting epoxy resin materials. This material is prone to sink marks during the reaction stage in the mold, and product defects such as internal and external pores cause direct scrapping of insulation products. The main reason is epoxy resin. Before the material enters the mold cavity, the thinner gate absorbs too much heat, causing the gate to solidify in advance and making subsequent feeding difficult

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  • Pouring gate structure of mould in APG process

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Embodiment Construction

[0009] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0010] Depend on figure 1 It can be seen that the present invention includes: a body 1; a gate 2 is included on the body 1; a cooling tank 3 is arranged at the entrance of the gate 2; a blowing nozzle aimed at the cooling tank 3 is also included 4.

[0011] The invention ensures that the injection nozzle of the mold is always at a relatively low temperature during the entire injection process, and avoids sink marks and pores (internal and external pores) of the thermosetting material product caused by the early curing of the epoxy material at the feeding port. And other forming defects that cannot be solved by process adjustment.

[0012] The invention adds air-cooling grooves and blowing nozzles on the mold to cool the mold runner and gate, reduce the excessive absorption of mold heat by the epoxy resin in the reaction stage, thereby reducing...

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Abstract

The invention relates to a pouring gate structure of a mould in an APG process. The pouring gate structure comprises a body (1) which comprises a pouring gate (2), wherein an inlet of the pouring gate (2) is also provided with a cooling groove (3). The pouring gate structure also comprises a blowing nozzle (4) pointing at the cooling groove (3). The pouring gate structure ensures the relatively low temperature of a material injection nozzle all the time, can maximally delay the solidification at the material injection nozzle so as to be beneficial to subsequent feeding of a formed product, maximally reduces formation defects such as product deformation, watermarks, air holes, and the like, and can well improve the qualification rate of components.

Description

technical field [0001] The invention relates to the gate part of the mold in the APG process. Background technique [0002] The APG process refers to a process in which the Automatic Pressure Generator (Automatic Pressure Generator) is injection-molded through a thermosetting mold using epoxy resin materials. [0003] Insulation parts of medium and high voltage electrical equipment are generally made of thermosetting epoxy resin materials. This material is prone to sink marks during the reaction stage in the mold, and product defects such as internal and external pores cause direct scrapping of insulation products. The main reason is epoxy resin. Before the material enters the mold cavity, the thinner gate absorbs too much heat, causing the gate part to solidify in advance and making subsequent feeding difficult. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a gate structure of a mold in the APG process, aimin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/27B29K63/00
Inventor 吴广军
Owner SHANGHAI ROX ELECTRIC
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