6results about How to "Reduce molding defects" patented technology

This invention provides a metal forming device for fire protection material processing, relating to the field of metal processing equipment. It includes a base, a processing frame mounted on top of the base, a start switch mounted on the left front end of the processing frame, a connecting column mounted on the inner wall of the rear end of the processing frame, a cylinder mounted on top of the connecting column, an upper mold fixedly connected to the output end of the cylinder, a lower mold mounted on the front end of the processing frame, and a control component mounted on the right outer wall of the processing frame. By integrating forming state acquisition, coupling judgment, real-time adjustment, deviation memory, and progressive pre-compensation modules into the control component, and forming a deeply coupled control execution chain with mechanical components such as the cylinder, mold, guide structure, and fine-tuning installation structure, this integrated design ensures that the input of the control system is entirely derived from real-time feedback of the physical process, and the output directly acts on the power source of the actuator, avoiding the problem of disconnection between control logic and mechanical operating state in traditional devices.

The application provides a forming process for an inner diameter deep cavity ring type forging, which comprises the following steps: ring rolling preforming, die forging preforming, ring rolling preforming, ring rolling final forging forming and the like. Through the above method, effective accumulation of metal materials in the inner diameter deep cavity is realized, and the flash of the forging and the forming defects of the forging are reduced.

The utility model discloses a kind of injection molding mechanisms of no moulding line, it is related to plastic product injection molding technical field, including base, heating tank, conveying outer tube, upper movable die and lower fixed die, the lower fixed die is fixedly connected on base in the base upper end, the lower fixed die below is provided with lifting plate, lifting plate upper end is fixedly connected with left and right two fixed columns, wherein fixed column is inserted in base and lower fixed die, lower fixed die upper end inner wall is provided with lower parting surface, lower fixed die upper end is provided with clamping groove, wherein upper and lower parting surface are slope structure, by mirror surface polishing and nanometer coating treatment, realize submicron level zero gap sealing when moulding, block melt overflow passage, eliminate the moulding line of moulding line produced by the problem of parting surface from root cause of traditional mould, forming piece precision, smoothness is high, and slope design makes upper movable die and lower fixed die can be automatically aligned and attached when moulding, without complex positioning mechanism, simplify mould structure, reduce the risk of positioning error to moulding line.

The application provides a sunken skin stretch forming path planning method, and belongs to the technical field of stretch forming path planning, and the method comprises the following steps: S1, acquiring the design parameters and forming constraint conditions of the sunken skin; S2, establishing a finite element model of the sunken skin; S3, initial stretch path global planning based on an echo state network-cell mapping hybrid algorithm; S4, finite element simulation verification of the initial stretch path; and S5, stretch path iterative optimization based on a fractional order Kalman filter-dove search hybrid algorithm. The application solves the problems of low stretch forming path planning precision, many forming defects, poor process stability, weak technical reproducibility and the like of the existing sunken skin stretch forming path planning.

This invention belongs to the field of semiconductor equipment technology and provides a semiconductor resin vibration powder dispensing device, including a powder dispensing mechanism, a vibration mechanism, and a support mechanism. The vibration mechanism includes a connecting seat for mounting the powder dispensing mechanism, a vibrator fixedly connected to the connecting seat, a protective cover located on the side of the vibrator away from the connecting seat and elastically connected to the vibrator, a weighing sensor installed inside the protective cover for acquiring the weight information of the material within the powder dispensing mechanism, and a mounting base fixedly connected to the end of the protective cover away from the vibrator and to the support mechanism at the end opposite to the vibrator. The powder dispensing mechanism and the vibration mechanism of this invention cooperate, utilizing the vibration generated by the vibrator to act on the powder dispensing mechanism, causing the resin powder to be evenly spread and stably conveyed under vibration, avoiding local accumulation or gaps, thereby ensuring uniform distribution of resin on the mold surface, significantly improving the consistency of the molded body thickness, and reducing molding defects caused by uneven powder dispensing.

This application discloses a battery device and an electrical device. The battery device includes: a housing; multiple battery cells, each having a casing and an electrical connection portion. In a first direction, the electrical connection portion is located on one side of the casing, and the multiple battery cells are electrically connected via electrical connectors. The housing has a first cavity wall opposite to the electrical connectors. A support structure is at least partially located between the casing and the first cavity wall, with a minimum distance between the support structure and the first cavity wall that is less than the minimum distance between the electrical connectors and the first cavity wall. At least one support structure is a first support structure and includes a first support portion and a second support portion connected together. The first support portion is located between two adjacent electrical connectors, and the second support portion is located between the casing and the electrical connectors. In the above technical solution, the support structure can transmit and disperse the external impact force borne by the first cavity wall. The first support structure can support the electrical connectors and increase the mating area with the casing, effectively reducing the risk of damage to the electrical connection structure.