Manufacturing method of advanced-generation TFT-grade fine-grain ITO target material

A manufacturing method and fine-grained technology, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the problems of lack of reach, large grain size of target material, uneven composition, etc., and achieve reduction Firing temperature, accurate composition ratio, and the effect of improving sintering activity
CN112723863APending Publication Date: 2021-04-30韶关市欧莱高纯材料技术有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
韶关市欧莱高纯材料技术有限公司
Publication Date
2021-04-30

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Abstract

The invention discloses a manufacturing method of an advanced-generation TFT fine-grain ITO target material. The manufacturing method comprises a powder preparation step, a mixing and grinding step, a spray granulation step, a compression molding step and a sinter molding step. According to the manufacturing method of the ITO target material, the ITO target material with large-size and high-density crystal grains can be manufactured, the density of the target material is larger than 99.9%, and the average crystal grain diameter is controlled to be 3-5 [mu]m.
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Description

technical field

[0001] The invention relates to the technical field of ITO target material manufacturing, in particular to a manufacturing method of high-generation TFT grade fine-grain ITO target material. Background technique

[0002] Indium tin oxide target, referred to as ITO target, is a mixture of two metal oxides, indium oxide and tin oxide, which is sintered at high temperature to form a ceramic functional material. The ITO target material sintered with tin oxide doped indium oxide can form an ITO transparent conductive film on transparent substrates such as glass after vacuum magnetron sputtering coating, which is a necessary key material for the liquid crystal display panel industry.

[0003] At present, the feasible sintering methods for ITO target production include hot pressing, hot isostatic pressing, pressure atmosphere sintering and atmospheric pressure sintering. The forming of the blank before the target sintering includes slip casting, compression molding...

Claims

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