Connection point structure as well as forming method and connecting structure thereof

A joint structure and contact technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve problems such as stress concentration, metal layer rupture, affecting electrical reliability, etc., and achieve the effect of avoiding stress concentration

Inactive Publication Date: 2009-11-11
台湾薄膜电晶体液晶显示器产业协会 +6
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the pillar-shaped polymer bumps are prone to stress concentration problems during lamination, which easily leads to cracks in the metal layer and affects its electrical reliability.

Method used

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  • Connection point structure as well as forming method and connecting structure thereof
  • Connection point structure as well as forming method and connecting structure thereof
  • Connection point structure as well as forming method and connecting structure thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0082] figure 1 It is a sectional view of the contact and the structure of the embodiment of the present invention. Please refer to figure 1 , the contact structure 100 of this embodiment is disposed on the substrate 200 . The contact structure 100 includes a pad 110 , a polymer bump 120 and a conductive layer 130 . The pads 110 are located on the substrate 200 . The polymer bump 120 is disposed on the substrate 200 , and the polymer bump 120 has an arc-shaped surface 122 and a steep surface 124 connected to the arc-shaped surface 122 . The included angle θ between the steep surface 124 and the substrate 200 is 30° to 150°. The conductive layer 130 covers the polymer bump 120 and is electrically connected to the pad 110 .

[0083] Based on the above, the polymer bump 120 of this embodiment has an arc-shaped surface 122 and a steep surface 124 connected to the arc-shaped surface 122 . Here, the steep surface 124 of the polymer bump 120 and the surface of the substrate 200 ...

no. 2 example

[0093] Figure 13 to Figure 24 It is a cross-sectional view of the contact structure of the second embodiment of the present invention. Figure 13 to Figure 24 The second embodiment shown is the same as Figure 1 to Figure 12 The illustrated embodiment is similar except that Figure 13 to Figure 24 In the embodiment, the arc-shaped surface 122 of the polymer bump 120 of the contact structure 300 further has a plurality of concave-convex structures 122a, or, in addition to the arc-shaped surface 122 of the polymer bump 120 of the contact structure 300, there are more plurality of concave-convex structures In addition to the structure 122a, the arc-shaped surface 152 of the polymer bump 150 of the contact structure 300 also has a plurality of concave-convex structures 152a.

[0094] Therefore, when a bonding material is disposed between the substrate 200 and another substrate and the polymer bump 120 is intended to be in contact with another substrate, the concave-convex struc...

no. 3 example

[0096] Figure 25 to Figure 36 It is a cross-sectional view of the contact structure of the third embodiment of the present invention. Figure 25 to Figure 36 The third embodiment shown is the same as Figure 1 to Figure 12 The illustrated embodiment is similar except that Figure 25 to Figure 36 In the embodiment, the arc-shaped surface 122 of the polymer bump 120 of the contact structure 400 is concave toward the direction of the substrate 200, or, except that the arc-shaped surface 122 of the polymer bump 120 of the contact structure 400 is concave toward the substrate 200 In addition to the concave direction, the arc-shaped surface 152 of the polymer bump 150 of the contact structure 400 is also concave toward the direction of the substrate 200 . Thus, in Figure 25 to Figure 36 In the illustrated embodiment, the junction of the arc-shaped surface 122 and the vertical surface 124 of the polymer bump 120 is a sharp structure. The junction of the arc-shaped surface 152 a...

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PUM

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Abstract

The invention discloses a connection point structure as well as a forming method and a connecting structure thereof. The connection point structure which is arranged on a basal plate comprises a connecting pad, a high-polymer bump and a conducting layer, wherein the connecting pad is positioned on the basal plate, the high-polymer bump is arranged on the basal plate and provided with an arc-shaped surface and a sharp plane connected with the arc-shaped surface, the high-polymer bump is covered by the conducting layer, and the conducting layer is electrically connected with the connecting pad.

Description

technical field [0001] The present invention relates to a joint structure and its joint structure and its forming method, and particularly to a joint structure, its forming method and its joint structure which are easy to penetrate through the joint material and will not produce stress concentration during jointing. Background technique [0002] With the progress of science and technology, various electronic devices are developing towards the direction of miniaturization and multi-function. Therefore, in order to enable the chip in the electronic device to transmit or receive more signals, the contacts electrically connected between the chip and the circuit board are also developing in the direction of high density. [0003] In the known technology, the method of electrically connecting the chip and the glass substrate is to arrange an anisotropic conductive film (Anisotropic Conductive Film, ACF) between the contact of the chip and the conductive structure of the glass subs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/485H01L23/488H01L21/60
CPCH01L2224/16225H01L2224/73204H01L2224/32225H01L24/11H01L2224/83101H01L2224/11H01L2924/15788H01L2924/00H01L2924/00012
Inventor 杨省枢张世明
Owner 台湾薄膜电晶体液晶显示器产业协会
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