Tcp handling device, and method for positional alignment of connecting terminals in the device

Abstract

A test pad of a tested TCP is photographed by a second camera (6b) so that its coordinate data is acquired. The coordinate data of characteristic portions (84) disposed in a probe card (8) is acquired in relation to the positional information of the contact faces of probes (81) of the probe card (8). The positional information of the contact faces of the probes (81) is estimated from the coordinate data of the characteristic portions (84). The positional displacements between the test pad and the probes (81) are determined from the acquired coordinate data of the test pads and the estimated positional information of the contact faces of the probes (81). The probe card (8) is moved by a probe card stage (7) on the basis of the positional displacements so that the probes (81) are automatically positioned with respect to the test pads of the tested TCP. As a result, the test pads of the TCP and the probes (81) of the probe card (8) can be positioned extremely precisely.

Description

technical field [0001] The present invention relates to be used for testing a kind of TCP (Tape Carrier Package: Tape Carrier Package) or COF (Chip On Film: Chip On Film) (hereinafter, TCP, COF and use other TAB (Tape Automated Bonding: coil) as one of IC devices Devices manufactured with automatic bonding) mounting technology are collectively referred to as "TCP"), a TCP processing device and a method for aligning positions of connection terminals in the device. Background technique [0002] In the manufacturing process of electronic components such as IC devices, it is necessary to have an electronic component testing device for performance or functional testing of the final IC device or a device in the middle of manufacturing. If it is a TCP device, use a TCP testing device. [0003] A TCP test device generally consists of a test machine body, a test head, and a TCP processing device (hereinafter also referred to as "TCP processor"). This TCP handler has a carrier tape t...

AI Technical Summary

Problems solved by technology

However, the contact surface of the probe facing the test pad of the TCP is located on the upper side of the probe card, so the contact surface of the probe cannot be photographed by the above-mentioned camera

Therefore, the position of the contact surface of the probe cannot be grasped (the actual position of the probe), and it is difficult to accurately align the test pad of the TCP with the probe of the probe card.

If the alignment between the TCP and the probe cannot be accurately performed, problems such as poor contact, unstable contact resistance, and short-circuit between adjacent pins will occur in actual operation.

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