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High-radiating light-emitting diode module and light-emitting diode lamps

A technology of light-emitting diodes and high heat dissipation, which is applied to semiconductor devices of light-emitting elements, light sources, point light sources, etc., and can solve the problems of reduced lighting brightness, large volume, and difficulty in increasing the number of radiators

Inactive Publication Date: 2009-11-25
廖运昌
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to avoid the large size of the cooling device from being unfavorable for the installation of the LED lamp, it is usually difficult to increase the number of radiators configured in the conventional cooling device. In addition, the heat transfer path between the metal heat conducting block and the radiator is not perfect, resulting in The heat dissipation effect is not yet satisfactory
Furthermore, conventional light-emitting diode lamps will reduce the brightness of the lighting due to mutual interference or scattering of light to the surroundings.

Method used

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  • High-radiating light-emitting diode module and light-emitting diode lamps
  • High-radiating light-emitting diode module and light-emitting diode lamps
  • High-radiating light-emitting diode module and light-emitting diode lamps

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Embodiment Construction

[0065] see Figure 1 to Figure 4 , shows the LED module 10 according to the first embodiment of the present invention; the LED module 10 includes an LED light source assembly 2 and a heat dissipation module 1 .

[0066] The light emitting diode light source assembly 2 includes a substrate 21 made of metal material and a plurality of light emitting diodes 22; the metal substrate has a first surface 211 and a second surface 212 opposite to each other, and a circuit board 23 is combined on the first surface 211 Each light emitting diode 22 is combined on the first surface 211 of the substrate and includes at least one light emitting diode chip 221 electrically connected to the circuit board 23 . In this embodiment, the substrate 21 is provided with a plurality of through holes 213, and the thickness of the substrate 21 is 0.5-1 mm.

[0067] The heat dissipation module 1 includes a heat dissipation body 11, a heat pipe 12 and two fin radiators 13; the interior of the heat dissipa...

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Abstract

The invention discloses a high-radiating light-emitting diode module comprising a substrate and a plurality of light-emitting diodes arranged on one surface of the substrate; the other surface of the substrate is connected to a combined surface of the radiating body. The radiating body has a receiving hole for receiving heat pipe. An opening that is communicated with the receiving hole is arranged on the combined surface of the radiating body. When the light-emitting diode substrate is combined to the combined surface of the radiating body, part of outer surface of the heat pipe can form direct heat contact with the other surface of the substrate via the opening to absorb heat generated by the light-emitting diode and the heat is discharged to outer environment via a fin radiator assembled by the other part located out of the radiating body.

Description

technical field [0001] The invention provides a light emitting diode module with a high heat dissipation structure. The invention also relates to a light-emitting diode lamp with high heat dissipation efficiency. Background technique [0002] Since light-emitting diodes (LEDs) have the advantages of high brightness, power saving and long life, light-emitting diode lamps composed of packaged light-emitting diodes have been widely used in display or lighting products. As far as lighting purposes are concerned, the mercury street lamps installed on both sides of the street to provide nighttime lighting are also gradually being replaced by LED lamps. [0003] LEDs generate high heat during operation. This heat must be removed to ensure high lighting power and service life of LED lamps. Therefore, high-power LED lamps are generally equipped with heat sinks to dissipate the heat generated inside the lamps. to the external environment. [0004] Conventional heat dissipation devi...

Claims

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Application Information

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IPC IPC(8): F21V29/00H01L23/367H01L23/427F21V5/00F21V11/00F21Y101/02F21V29/51F21V29/77F21Y115/10
CPCH01L2924/0002
Inventor 廖运昌
Owner 廖运昌
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