High-radiating light-emitting diode module and light-emitting diode lamps

[0065] See Figure 1 to Figure 4 , Shows a light emitting diode module 10 constructed according to the first embodiment of the present invention; the light emitting diode module 10 includes a light emitting diode light source assembly 2 and a heat dissipation module 1.

[0066] The light-emitting diode light source assembly 2 includes a substrate 21 made of a metal material and a plurality of light-emitting diodes 22; the metal substrate has a first surface 211 and a second surface 212 opposite to each other, and a circuit board 23 is combined on the first surface 211 Each light emitting diode 22 is combined on the first surface 211 of the substrate and includes at least one light emitting diode chip 221 electrically connected to the circuit board 23. In this embodiment, the substrate 21 is provided with a plurality of through holes 213, and the thickness of the substrate 21 is 0.5-1 mm.

[0067] The heat dissipation module 1 includes a heat dissipation body 11, a heat pipe 12, and two fin heat sinks 13. The heat dissipation body 11 has a heat pipe receiving hole 111 inside, and the heat dissipation body 11 has a second surface 212 that can provide a substrate 21 for bonding The joint surface 112 is a flat surface, and the joint surface 112 is provided with an opening 114 communicating with the heat pipe receiving hole 111; in this embodiment, the heat dissipation body 11 is made of a metal such as copper A rectangular body made of material. A straight side of the block forms the bonding surface 112, and a plurality of bonding holes 115 are provided on the bonding surface 112, and the plurality of connecting members 3 are used to penetrate the number of through holes 213 and the number The coupling hole 115 couples the substrate 21 to the coupling surface 112 of the heat dissipation body 11.

[0068] The heat pipe 12 has an outer surface 124, a first part 123 sleeved in the heat pipe receiving hole 111 of the heat dissipation body 11, and a second part 121 and a third part 122 located outside the heat dissipation body 11; in this embodiment, The heat pipe has a first end, a second end, and a middle part between the two ends. The middle part forms the first part 123, the first end forms the second part 121, and the second end forms the third part 122. When the heat pipe 12 is inserted into the heat pipe receiving hole 111, a part of the outer surface 124 of the first portion 123 will be exposed at the opening 114 of the heat dissipation body 11 to contact the substrate 21 (see Figure 4 ). In this embodiment, the heat pipe 12 is a round pipe made of a metal material such as copper, and the heat pipe 12 is filled with a heat transfer medium 14. The heat transfer medium is preferably a heat transfer material with superconducting efficiency. . In this embodiment, the heat transfer medium includes an aqueous solution of a salt, which is composed of one or more metal ions selected from copper, silver, gold, nickel, chromium, zinc, titanium, and cobalt, and organic acid or inorganic Complexes formed by acids.

[0069] Each fin heat sink 13 includes a plurality of separated fins, and the fins can be made of copper, aluminum, or a composite material containing carbon fiber and metal. In this embodiment, the two fin heat sinks 13 are individually installed on the second part 121 and the third part 122 of the heat pipe 12, and each fin heat sink 13 can use air convection to dissipate heat.

[0070] In the light emitting diode module 10 constructed according to the present invention, the heat dissipating body 11 of the heat dissipating module 1 provides convenient assembly of the light emitting diode substrate 21, and the heat dissipating body 11 and the heat pipe 12 have a wide contact area to effectively The heat generated by the light emitting diode is transferred to the heat pipe 12, and a part of the outer surface of the heat pipe 12 is in direct thermal contact with the substrate 21, so that the heat generated by the light emitting diode can quickly pass through the heat pipe 12 and the heat transfer medium inside the heat pipe 14 is taken away from the substrate 21, and then passes through the two fin heat sinks 13 to naturally convection with the air, so as to have a rapid heat removal effect.

[0071] Refer to Figure 5 to Figure 8 , Showing the light emitting diode module 10 constructed according to the second embodiment of the present invention (in this embodiment, the same or equivalent components as those described in the first embodiment will be attached with the same reference numerals and detailed structural descriptions will be omitted); The heat dissipation module 1 includes a heat dissipation body 11, a heat pipe 12, and two fin heat sinks 13. The difference between the second embodiment and the first embodiment is that the heat dissipation body 11 is composed of a tube body formed of a thin metal plate. There is an opening 114 in the length direction. Two edges 117 of the opening 114 are respectively bent outward to form a folded edge 116. The two flat folded edges 116 form a bonding surface 112 for bonding the LED substrate 21, and the tube body The arc tube wall forms a support portion for housing the heat pipe 12. The tube wall of the heat dissipation body 11 of this embodiment is relatively thin, which can further improve the heat dissipation efficiency of the heat dissipation module 1, and the heat dissipation body 11 facilitates the assembly of the heat pipe 12.

[0072] Refer to Picture 9 and Picture 10 , Showing the light emitting diode module 10 constructed according to the third embodiment of the present invention; in this embodiment, the third part 122 of the heat pipe of the first embodiment and the heat sink 13 mounted on the third part 122 are deleted to reduce The length and volume of the heat dissipation module 1. That is, the first end of the heat pipe 12 constitutes the first part 123 received in the heat pipe receiving hole 111, and the second end of the heat pipe 12 constitutes the second part 121 located outside the heat dissipation body 11.

[0073] Refer to Figure 11 to Figure 17 , Shows a light-emitting diode module 10 constructed according to another embodiment of the present invention and a light-emitting diode lamp 6 having the light-emitting diode module 10; in this embodiment, the light-emitting diode lamp 6 is a street lamp that provides night lighting.

[0074] The LED lamp 6 includes a lamp housing 5, a LED light source assembly 2 and a heat dissipation assembly 1 housed in the lamp housing 5. In this embodiment, the same or equivalent components as those described in the first embodiment will be described with the same reference numerals attached. The lamp housing 5 is formed by relatively combining a first cover (upper cover) 51 and a second cover (lower cover) 52. The first cover 51 and the second cover 52 are respectively provided with a plurality of ventilation holes 53 Moreover, one end of the first cover 51 has a semicircular mounting hole 54, and a mounting plate 55 is assembled inside the mounting hole 54 to be combined and positioned at the upper end 41 of a telegraph pole 4. The second cover 52 has an opening 56 that can transmit light in the middle. The first cover 52 has a chamber 57 therein, and the chamber 57 can be filled with cooling liquid to cool the heat dissipation component 1 (not shown). The first cover 52 has a recess 58 therein, and the recess 58 houses a power supply 8, and the power supply 8 supplies power to the light emitting diode lamp 6.

[0075] The LED light source assembly 2 includes a substrate 21 made of a metal material and a plurality of LEDs 22 arranged on the substrate 21. In this embodiment, the substrate 21 includes a plurality of parallel parallel strip plates. The substrate 21 has a first surface 211 and a second surface 212 opposite to each other. The first surface 211 is combined with the circuit board 23, and The substrate 21 is provided with a through hole 213. The number of light-emitting diodes 22 are arranged on the first surface 211 of the substrate 21 and are electrically connected to the circuit board 23; in this embodiment, the number of light-emitting diodes 22 form a parallel-spaced array of multiple rows, each row of The light emitting diode 22 has a longitudinal axis. The outside of the substrate 21 is covered by a transparent glass cover 24 and a frame body 25. The transparent glass cover 24 is correspondingly located on the transparent opening 56 of the second cover 52, so that the light-emitting diode 22 emits The light can be irradiated outward or downward through the opening 56.

[0076] The light-emitting diode light source assembly 2 further includes a plurality of light-concentrating assemblies 26 that are generally strip-shaped, and each of the light-concentrating assemblies 26 is assembled on the first surface 211 of the substrate 21 along a direction parallel to the longitudinal axis, and is located in one of the rows to emit light. On the diode 22, and each condensing component 26 is provided with a plurality of separated condensing holes 261, each condensing hole 261 is aligned with and accommodates a light emitting diode 22, and the outer end of the inner wall of the condensing hole 261 forms a horn shape The cone-shaped opening 262 (see Figure 16a ), so that the light-emitting diode 22 has a light-gathering effect when emitting light outward.

[0077] In this embodiment, the light-emitting diode light source assembly 2 further includes a plurality of light-blocking walls 27 that are generally strip-shaped. Each light-blocking wall 27 is assembled on the first surface 211 of the substrate 21 along a direction parallel to the longitudinal axis. Located between the two rows of light-emitting diodes 22, in this embodiment, each light-blocking wall 27 is fixed on the substrate 21 with screws 28. Each light-blocking wall 27 has a bottom surface 271 coupled to the first surface 211 of the substrate 21, a top surface 273 opposite to the bottom surface 271, and two side surfaces 272. The two side surfaces 272 form an inclined surface that narrows to the top surface 273. When the light-emitting diode 22 emits light outward, the two side surfaces 272 of the light-blocking wall 27 have the effect of blocking the light from dispersing outward and reflecting the light source to improve the brightness of the illumination.

[0078] The heat dissipation assembly 1 includes a heat dissipation body 11, a plurality of first heat pipes 12, a plurality of second heat pipes 15 and a plurality of heat sinks 13; in this embodiment, the heat dissipation body 11 is made of a thermally conductive metal material such as copper, aluminum, etc. The heat dissipating body 11 has a flat bonding surface 112 connected to the second surface 212 of the substrate 21. The bonding surface 112 is provided with a plurality of bonding holes 115, which are penetrated by a plurality of connectors 3 The through hole 213 of the substrate 21 extends into the coupling hole 115 of the heat dissipation body 11 to combine the two; the heat dissipation body 11 has a plurality of first receiving holes 111 spaced apart and parallel to each other, and each first receiving hole 111 It has a longitudinal axis which is parallel to the longitudinal axis of the light emitting diode 22. In this embodiment, the cross section of each first receiving hole 111 is generally circular and adjacent to the coupling surface 112; Figure 16a The gap (D) between the portion of the outer periphery of each first receiving hole 111 facing the bonding surface 112 of the heat dissipation body 11 and the second surface 212 of the substrate 21 is less than 0.5 mm, that is, between 0.5 mm and 0 (that is, communicating )In the range.

[0079] The heat dissipation body 11 further has a plurality of second receiving holes 118 spaced apart and parallel to each other. The extension direction of each second receiving hole 118 is substantially perpendicular to the longitudinal axis of the first receiving hole 111 and extends through the heat dissipation body 11. In this embodiment, the cross-section of the second receiving hole 118 is generally circular.

[0080] In this embodiment, the first heat pipe 12 has an outer surface 124, a first part 123 received in the first receiving hole 111 of the heat dissipation body, and a second part 121 (see Figure 17 ); After each first heat pipe 12 is received in the first receiving hole 111, the portion of the first part of the outer surface 124 facing the bonding surface 112 of the heat dissipation body 11 is adjacent to the second surface 212 of the substrate 21; and each second heat pipe 15 has The first part 151 received in the second receiving hole 118 of the heat dissipation body, and a second part 152 and a third part 153 located outside the heat dissipation body 11; in this embodiment, each of the first heat pipe 12 and the second heat pipe 15 is composed of, for example, A round tube made of copper metal material and filled with a heat transfer medium such as superconducting liquid.

[0081] Each heat sink 13 includes a plurality of separated fins 131. In this embodiment, the fins 131 are made of a composite material containing carbon fiber and metal, and have high heat dissipation efficiency. In this embodiment, a radiator 13 is separately installed on the second portion 121 of the first heat pipe 12 and the second portion 152 and the third portion 153 of the second heat pipe 15, and each radiator 13 can use air convection to radiate Heat; and the outer end surface of each radiator 13 is provided with a heat conduction block 17, so that the heat transferred to each radiator 13 can more quickly spread to the entire radiator.

[0082] Refer to Figure 18 and Figure 19 ,display Figure 13 to Figure 17 In another embodiment of the heat dissipating body 11 in, the joint surface 112 of the heat dissipating body 11 is provided with an opening 114 communicating with the first receiving hole 111, so that the joint surface 112 of the first receiving hole 111 facing the heat dissipating body 11 The gap (D) between the wall portion of the hole and the second surface 212 of the substrate 21 is 0 (that is, connected), and the outer surface 124 of the first portion 123 of the first heat pipe inserted into the first receiving hole 111 is partially exposed At the opening 114 of the heat dissipating body 11, direct thermal contact is formed with the substrate 21, so that the heat generated by the light emitting diode can be quickly carried away from the substrate 21 through the first heat pipe 12 and the heat transfer medium inside the first heat pipe, and then Then, the two fin heat sinks 13 at the two ends of the first heat pipe 12 naturally convection with the air to quickly dissipate heat.

[0083] The light-emitting diode module 10 constructed according to the present invention can make the light-emitting diodes have high heat dissipation efficiency, and is advantageous for the connection between the array of heat dissipation modules 1 to form an array type. Furthermore, the heat dissipation modules 1 can be combined with each other by one side of the heat dissipation body 11, and the fins of the heat sinks 13 of the two heat dissipation modules 1 are arranged at intervals, so that the number of the heat dissipation modules 1 can be expanded to provide better heat dissipation. effect. In addition, the heat dissipating body 11 forms a vertical cross matrix with the first heat pipe 12 and the second heat pipe 15, which can effectively transfer the heat generated by the light emitting diode 22 to the radiator 13 for heat dissipation, especially the first heat pipe Part of the outer surface of 12 is adjacent to or in contact with the substrate 21, so that the heat generated by the light emitting diode can be quickly taken away from the substrate 21 through the first heat pipe 12 and the second heat pipe 15 to achieve high heat dissipation efficiency.

[0084] In the foregoing specification, the present invention is only described in terms of specific embodiments, and it is understandable that various changes or modifications can be made according to the design features of the present invention. For example, one side of the heat dissipation body 11 can be used as a substrate. The light emitting diode 22 is directly assembled on the heat dissipation body 11. Therefore, the obvious substitutions and modifications that can be made by those familiar with the art will still fall within the scope of the patent claimed by the present invention.