Needle track inspection device, detecting device and needle track checking procedure

Abstract

The invention provides a needle track inspection device, a detecting device with the same and a needle track checking procedure, capable of automatically detecting whether a basal layer of an electrode pad is exposed at the high precision. The needle track inspection device comprises a needle track region withdrawing part (50) for withdrawing the needle track region (13) from camera shooting data (D1), wherein the camera shooting data (D1) being obtained by a camera (72) for shooting an electrode pad (2), a greyscale grade data obtaining part (51) for obtaining the greyscale pattern corresponding to the pixel grey level and the pixel position on a center line (P) extending in the length direction of the needle track region for the needle track region (13), and a deep dug judging part (53) for judging whether the basal layer (6) is exposed based on the obtained greyscale pattern and the reference pattern when the basal layer (6) is exposed out of the needle track (10).

Description

technical field [0001] The present invention relates to a stitch inspection device, a stitch inspection method, and a detection device equipped with the stitch inspection device, which automatically detects exposure conditions such as the presence or absence of the base layer of electrode pads on a substrate after inspection using a probe. Background technique [0002] Conventionally, a probe device has been used as a device for measuring electrical characteristics of an IC chip formed on a semiconductor substrate. The probing device includes a table on which the substrate is placed and can move freely in the three-dimensional direction, and a probe card. The so-called probe test is performed, that is, the probes of the probe card are brought into contact with the electrode pads, which are in contact with the electrode pads on the substrate. The wiring patterns are connected to perform electrical measurements on the chip. [0003] Generally, a probe is used as a probe, and ...

AI Technical Summary

Problems solved by technology

Therefore, in the case of determining the exposed area 111 using existing devices, as Figure 18 shown, from Figure 18 The black and white image of (a) is obtained Figure 18 In the binarized image shown in (b), it is impossible to distinguish between the shadow part 112 and the exposed area 111 of the chips

Therefore, there will be a problem that the exposed area 111 is misrecognized as the shadow portion 112 of the chip, and the chip on which the exposed area 111 is formed is determined to be a good product; or conversely, the shadow portion 112 of the chip is misidentified as the ex

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