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Semiconductor lead heading machine

A technology for semiconductors and heading machines, which is applied in semiconductor/solid-state device manufacturing, circuit/current collector parts, metal extrusion, etc. It can solve problems such as low precision, burrs, rough surfaces, etc., to improve precision and improve production efficiency , smooth surface effect

Active Publication Date: 2009-12-02
光路新能源材料(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The wires of plastic-encapsulated diodes need to be headed at one end during production. The quality of the products produced by the existing head equipment is poor, and there are defects such as low precision, rough surface, scratches, and burrs.

Method used

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  • Semiconductor lead heading machine

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Embodiment Construction

[0010] The present invention will be further described below in conjunction with accompanying drawing.

[0011] Such as figure 1 As shown, the semiconductor wire heading machine includes a machine platform 1, and a wire feeding mechanism 2, a front mold 3, a rear mold 4, a bumper 5, and a pushing mechanism 6 arranged on the machine platform 1. The front and rear molds 3 , 4 can be combined to form a mold cavity, the front and rear molds 3 and 4 lock the wire blank sent by the wire feeding mechanism 2 into the mold cavity, and the pushing mechanism 6 pushes the bumper 5 to hit one end of the wire blank to form the end. The pushing structure described above includes a main shaft 61 driven by a motor, a clamping cam 62 rotating with the main shaft 61, a bumper cam 63, a transmission member 64, a mold clamping slider 65 and a bumper slider 66, and the transmission member 64 Rotate and fix on the machine table 1, the mold locking slider 65 is in close contact with the mold locking...

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Abstract

The invention relates to a semiconductor lead heading machine which comprises a machine table and also comprises a lead feeding mechanism, a front mould, a rear mould, an impaction head and a pushing mechanism which are arranged on the machine table, wherein the front mould and the rear mould form a mould cavity after involution, a lead blank fed by the lead feeding mechanism is locked into the mould cavity by the front mould and the rear mould, the pushing mechanism pushes the impaction head to impact one end of the lead blank so as to enable the end to mould, the pushing mechanism comprises a main shaft driven by a motor, a locking mould cam which rotates along with the main shaft, an impaction head cam, a driving piece, a locking mould sliding block and an impaction head sliding block, wherein the driving piece is rotatably fixed on the machine table, the locking mould sliding block and the locking mould cam are closely attached, the locking mould cam which rotates along with the main shaft pushes the locking mould sliding block, the locking mould sliding block pushes the rear mould by the driving piece so as to enable the mould to be locked up and down, the impaction head is arranged at one end of the impaction head sliding block, the other end of the sliding block and the impaction head cam are closely attached, and the impaction head cam drives the impaction head sliding block so as to enable the impaction head to hit the lead blank for molding. The invention greatly improves the production efficiency.

Description

technical field [0001] The invention relates to the processing of semiconductor wires, in particular to a semiconductor wire heading machine. Background technique [0002] Semiconductor wire is a kind of multi-standard, multi-size and special-purpose semiconductor wire that is made by physically changing oxygen-free copper material (OFC) into wires with a wire diameter of 1.5mm-04mm, and then undergoing physical changes (such as stamping and forming). Wires of various shapes. [0003] The wires of plastic-encapsulated diodes need to be headed at one end during production. The quality of the products produced by the existing header equipment is poor, and there are defects such as low precision, rough surface, scratches, and burrs. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a semiconductor wire heading machine in order to overcome the above-mentioned defects in the prior art. [0005] The object of the prese...

Claims

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Application Information

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IPC IPC(8): H01R43/28H01L21/60B21C25/00B21C25/02
Inventor 吕勇逵
Owner 光路新能源材料(上海)有限公司
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