Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

A technology of a substrate processing device and a substrate processing method, which is applied to each unit, substrate processing device and substrate processing, substrate holding mechanism and substrate holding, various components or devices, and the field of substrate holding mechanism, which can solve the problem of unstable flow of pure water, etc. problems, to achieve reliable control, improve processing efficiency, and improve responsiveness and latency

Active Publication Date: 2014-03-12
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the conventional structure, since one head (header) supplies pure water to each grinding unit through a plurality of pipes, the flow rate of pure water in a certain grinding unit may sometimes be affected by the use of pure water in other grinding units. unstable situation

Method used

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  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

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Embodiment Construction

[0121] Hereinafter, embodiments of the substrate processing apparatus of the present invention will be described in detail with reference to the drawings. The same or equivalent structural elements are given the same reference numerals and their repeated description is omitted.

[0122] figure 1 It is a plan view showing the overall structure of a substrate processing apparatus according to an embodiment of the present invention. Such as figure 1 As shown, the substrate processing apparatus has a housing 1 having a substantially rectangular shape, and the interior of the housing 1 is divided into a load / unload part 2, a polishing part 3, and a cleaning part 4 by partition walls 1a and 1b. The loading / unloading section 2, the polishing section 3, and the cleaning section 4 described above are each independently combined and exhausted independently. In addition, the substrate processing apparatus has a control unit 5 that controls substrate processing operations.

[0123] The loadi...

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PUM

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Abstract

A substrate processing apparatus, a substrate processing method, a substrate holding mechanism, and a substrate holding method are disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

Description

Technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method, and in particular to a substrate processing apparatus and a substrate processing method used when polishing a substrate such as a semiconductor wafer or the like. [0002] In addition, the present invention also relates to a substrate holding mechanism and a substrate holding method, and particularly relates to a substrate holding mechanism suitable for a cleaning device or a drying device for a substrate such as a semiconductor wafer. [0003] In addition, the present invention also relates to units, various parts, or devices used in the substrate processing apparatus. Background technique [0004] In recent years, with the advancement of high integration of semiconductor devices, circuit wiring has gradually become finer, and the distance between wiring has gradually become smaller. In the manufacture of semiconductor devices, various materials are repeatedly...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/02B24B29/02B08B3/02B05B3/12H01L21/677H01L21/683H01L21/687H01L21/66
Inventor 宫崎充胜冈诚司松田尚起国泽淳次小林贤一外崎宏筱崎弘行锅谷治森泽伸哉小川贵弘牧野夏木
Owner EBARA CORP
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