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Return loss techniques in wirebond packages for high-speed data communications

一种线焊、地线的技术，应用在数据通信领域，能够解决导线互感妨碍、限制总电感等问题

Active Publication Date: 2009-12-16
ALTERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods are hindered by the mutual inductance between the wires, which limits the improvement of the total inductance
As signal frequency increases, return loss due to signal line inductance becomes an important issue to be overcome

Method used

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  • Return loss techniques in wirebond packages for high-speed data communications
  • Return loss techniques in wirebond packages for high-speed data communications
  • Return loss techniques in wirebond packages for high-speed data communications

Examples

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Embodiment Construction

[0018] The following embodiments describe an apparatus and method for reducing return loss in wire bond packages by reducing the inductive component in active signal lines. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without some or all of these specific details. In other instances, well known process operations have not been described in detail in order not to unnecessarily obscure the present invention.

[0019] figure 1 Illustrated is a wire bond package 100 configured in accordance with one embodiment of the invention for reducing wire bond return loss. This wire bond package is an example and it should be noted that the following disclosure is applicable to other embodiments of wire bond packages as long as they maintain the requisite functions of providing power, ground and input signals and receiving output signals from the integrated circuit. Integrated circuit 104 is typically, though not necessarily, mounted ...

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PUM

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Abstract

The present invention provides return loss techniques in wirebond packages for high-speed data communications. An integrated circuit of interest with rows of bonding pads is bonded to a surface of the wirebond package. The surface of wirebond package has columns of bonding pads, which are configured to transmit or receive signals, power, and ground to and / or from the wirebond package to the integrated circuit. Corresponding die pads on the integrated circuit and bonding pads of the wirebond package are coupled using conductive lines. The conductive lines carrying the active signal has coplanar adjacent ground lines on opposing sides of active signal line and the distance between active signal line and the coplanar adjacent ground lines is tapered.

Description

technical field [0001] The present invention relates to the field of data communication, and more particularly, the present invention relates to improved techniques for return loss in wirebond packages for high-speed data communication. Background technique [0002] Traditionally, the technology trend toward high-frequency products has required the use of flip-chip (flipchip) packaging. The use of flip-chip packaging comes at the expense of increased cost and higher processing complexity. Several high-frequency products designed for flip-chip implementations could be packaged using the wire-bond alternative if it were possible to improve the wire-bond packaging configuration while maintaining cost benefits over flip-chip packaging. Specifically, the effect of inductance in wire bonded packages significantly hinders meeting return loss specifications in several high frequency applications. [0003] Return loss measures the amount of electrical energy lost due to reflections...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/49H01L21/60H04B3/20
CPCH01L2224/45015H01L2224/484H01L2924/3011H01L2224/49113H01L2224/48247H01L2223/6611H01L24/02H01L2924/19107H01L2924/20752H01L2924/14H01L2924/01033H01L23/66H01L2224/48257H01L2224/4943H01L2224/48091H01L2224/49171H01L2924/014H01L2924/30107H01L24/48H01L2924/19051H01L24/49H01L2924/30111H01L2924/00014H01L2224/05554H01L24/05H01L2224/49433H01L2924/00H01L2224/45099H01L2224/05599
Inventor W·W·贝雷扎石宏
Owner ALTERA CORP