Mass production method for ultra-fine bonding gold wire

Abstract

The invention discloses a mass production method for an ultra-fine bonding gold wire. The production method comprises the steps of a fusion casting process (alloy fusion casting), a fiber drawing process (coarse drawing, intermediate drawing, fine drawing and ultrafine drawing), an annealing process (final annealing and performance test), a winding process (fixed size compound winding) and the like. The method improves the alloy fusion casting process and the annealing process aiming at the mass production of the ultra-fine bonding gold wire, in the fusion casting process, by mainly utilizingthe intermittent pull casting, and intermittently inhibiting the formation of columnar crystal, the small shaft diameter is formed conveniently, so that the extensibility of a cast ingot is ensured, and simultaneously certain strength can also be achieved, and the processing requirements of the ultra-fine bonding gold wire are better met. The product prepared by the method is suitable for the miniaturization packaging requirements of integrated circuits and large scale integrated circuits as well as low-cost requirements of packaging discrete devices and LEDs. The method has the characteristics of high yield of the ultrafine wire and good consistency among batch materials, and meets the requirements of batch and mass stable production.

Description

Large-scale production method of ultra-fine bonding alloy wire technical field The invention relates to a method for producing bonding alloy wires, in particular to a method for large-scale production of ultra-fine bonding alloy wires. Background technique With the rapid development of the microelectronics industry, the continuous improvement of microelectronics technology, the continuous reduction of IC characteristic parameters, the integration degree is increasing at an alarming rate, and the integration degree of VLSI has been following the "Moore's Law" and has been increasing rapidly at a rate of doubling every 18 months. , the number of circuit elements integrated on a chip has already exceeded 100 million, so this development trend is changing the role of VLSI in electronic equipment from a device chip to a system-on-chip (SOC); at the same time, deep sub-micron VLSI The process feature size has reached below 0.18μm. With the continuous reduction of feature size, i...

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Problems solved by technology

However, the thinner the gold wire, the more difficult it is to produce, the more difficult it is to draw the wire, and it is very easy to break or the gold wires will stick to each other, resulting in a low yield, especially for ultra-fine bonding gold wires of 17 microns and below. In production, it is particularly obvious that the existing improvement methods generally only improve the composition of raw materials, such as "A Bonding Gold Wire and Its Manufacturing Method" in Chinese Patent 200610021373.2, and some improve the production method, such as in Chinese Patent 200410017008.5 "Preparation method of ultra-fine wire of non-ferrous metal and its alloy material", which uses the horizontal directional continuous casting process to improve the performance of the cast billet to increase the yield. At present, these existing gold wire production methods can basically meet the requirements of 18 microns and above. The mass production of alloy wire is required, and the ultra-fine bonding gold wire of 17 microns and below is produced through the existing production process, which frequently breaks the wire during the processing process and the production efficiency is low. At the same time, customers are prone to quality problems when using such gold wire. For example, the surface quality of the gold wire is not good, the wire is not good, the performance is unstable, etc., the gold wire is prone to sticking, wire breakage or equipment alarm during bonding, resulting in low bonding efficiency and yield, and cannot effectively meet customer needs.

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