Silicon-based metal alloy thin film, casing and electronic device with the thin film, and manufacturing method
A technology of alloy film and electronic device, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the problems of uneven distribution of decorative coating, large color difference between batches, and low production yield. Achieve the effect of increasing product value, high production yield, and small color difference
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[0023] FIG. 2A shows a schematic diagram of the silicon-based metal alloy thin film of the present invention. In this embodiment, the silicon-based metal alloy thin film 2 is made by sputtering using a silicon-based metal alloy target (not shown). Wherein, according to different applications, the sputtering method can be selected to use direct current (DC) sputtering, direct current plus pulse (DC and pulse) sputtering or radio frequency (RF) sputtering.
[0024] In this embodiment, the silicon content of the silicon-based metal alloy thin film 2 is 62% to 85% by weight, and the rest is metal. Wherein, the metal is selected from the group of aluminum, nickel, titanium, zinc or a combination thereof, preferably, the silicon-based metal alloy is silicon-aluminum alloy. The thickness of the silicon-based metal alloy thin film 2 is preferably 200 to 600 nanometers. In this embodiment, the thickness of the silicon-based metal alloy thin film 2 is 500 nanometers, and the resistance...
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