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Case-molded capacitor and method for using the same

A capacitor and molded technology, which is applied in the field of shell molded capacitors, can solve the problems of the insulation breakdown voltage and electrical characteristics of the capacitor element 101, etc., and achieve the effect of suppressing the decline of electrical characteristics

Active Publication Date: 2010-01-20
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005]However, in this conventional case molded capacitor, when it is used in a large ripple current or high temperature environment, etc., when it is necessary to remove the heat generated by the capacitor element 101, Depending on the material of the molded resin 106, heat may remain on the capacitor element 101, and when the heat remains on the capacitor element 101, there is a problem that the electrical characteristics of the capacitor element 101 decrease visually such that the breakdown voltage (BDV) decreases.

Method used

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  • Case-molded capacitor and method for using the same
  • Case-molded capacitor and method for using the same
  • Case-molded capacitor and method for using the same

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Embodiment approach 1

[0028] figure 1 It is a plan view showing the configuration of the case-mold capacitor according to Embodiment 1 of the present invention. figure 2 is its front section. exist figure 1 , figure 2 Among them, the capacitor element 1 is configured as follows: a metallized film on which metal vapor-deposition electrodes are formed on one or both surfaces is wound so that a pair of metal vapor-deposition electrodes face each other with a dielectric film interposed therebetween; There are electrodes. The bus bar 2 formed of a copper plate has an electrode terminal 2 a for external connection provided at one end of the bus bar 2 . The bus bars 2 are joined to the metallized electrodes 3 formed on both end surfaces of the respective capacitor elements 1 in a state where the two capacitor elements 1 are closely arranged. The electrode terminal 2 a is drawn upward from the capacitor element 1 and exposed from the metal case 4 . The metal case 4 made of aluminum is mainly made...

Embodiment approach 2

[0045] image 3 It is a front cross-sectional view showing the structure of a case-mold capacitor according to Embodiment 2 of the present invention. Figure 4 It is a front cross-sectional view showing the configuration of the case-mold capacitor according to Embodiment 2 of the present invention on the opposite side. Figure 5 It is a plan view showing the structure of the case-mold capacitor according to Embodiment 2 of the present invention. Components that are the same as those in Embodiment 1 are denoted by the same reference numerals.

[0046] This embodiment differs from Embodiment 1 in bus bars 2b, 2c. Such as Figure 4 As shown, the bus bar 2b has a long connection terminal 2f connected to the metallization electrode 3 . Furthermore, the joint terminal 2 f is in contact with the insulating heat conduction layer 6 . On the other hand, if Figure 5 As shown, the bus bar 2c on the opposite side has a shorter junction terminal 2g to which the metallization electrod...

Embodiment approach 3

[0049] Figure 6 is a plan view showing the configuration of a case-mold capacitor according to Embodiment 3 of the present invention; Figure 7 It is a front cross-sectional view showing the structure of a case-mold capacitor according to Embodiment 3 of the present invention. This embodiment differs from the case molded capacitor described in the first embodiment above in the configuration of the arrangement of the capacitor element 1 and the bus bar 2 , but other configurations are the same as those of the first embodiment. and figure 1 , figure 2 The same reference numerals are used for the same parts and their detailed descriptions are omitted. Hereinafter, only different parts will be described with reference to the drawings.

[0050] In this embodiment, the placement of the capacitor elements 1 differs by 90 degrees. If the placement of the capacitor in Embodiment 1 is "horizontal placement", the placement of the capacitor element in this embodiment is "vertical ...

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Abstract

A case-molded capacitor is provided by connecting a bus bar, which has an electrode terminal for external connection, to an electrode section of a capacitor element, storing the capacitor element and the bus bar in a metal case whose upper surface is opened, and performing resin molding. The case-molded capacitor has a structure wherein an insulating heat transfer layer is arranged between a bottom surface of the metal case and the capacitor element, and is strong against heat.

Description

technical field [0001] The present invention relates to a case-mold capacitor in which a capacitor element is resin-molded in a case, and more particularly to a case-mold capacitor used as a smoothing capacitor for an inverter circuit driven by a motor used in vehicles. Background technique [0002] In recent years, metallized film capacitors used in inverters have been increasingly developed for miniaturization, high performance, and low cost. In addition, metallized film capacitors used in inverters require higher voltages, larger currents, and larger capacities. Therefore, a number of capacitor elements connected in parallel are housed in a case and injected into the case. Resin-molded case-molded metallized film capacitors are gradually being put into practical use. Such case molded metallized film capacitors are required to have high mechanical strength, high heat resistance temperature, excellent water resistance and oil resistance. [0003] Figure 9 is a front cros...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G2/08H01G4/18H01G4/224H01G4/38
CPCH01G4/38H01G4/224H01G2/08H01G4/18
Inventor 藤井浩岛崎幸博竹冈宏树久保田浩
Owner PANASONIC CORP