Method for dissipating charges on end face of cover tape

A technology of charge dissipation and cover tape, applied in the direction of flexible coverings, packaging, layered products, etc., can solve the effect of affecting the heat seal stability of the heat seal layer and the carrier tape, bad, static electricity caused by tearing the cover tape, etc. question

Inactive Publication Date: 2010-02-17
LIANMENG ELECTRONICS TECH KUSN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In doing so, it will be like coating a better quality antistatic agent on the lower layer to obtain a better conductive effect, which will directly affect the effect of heat sealing stability between the heat seal layer and the carrier tape
[0006] After heat sealing, the electrostatic agent will be mixed into the glue of the heat seal layer, which is the cause of static electricity wh...

Method used

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  • Method for dissipating charges on end face of cover tape
  • Method for dissipating charges on end face of cover tape
  • Method for dissipating charges on end face of cover tape

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Embodiment Construction

[0018] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0019] like figure 1 , 2 As shown, the method for dissipating charge on the end surface of the cover tape is used in the sealing process of the cover tape 1 and the carrier tape 2, wherein the cover tape 1 includes an upper surface layer 11, an intermediate layer 12 and a heat-sealing layer 13 from top to bottom. , the heat-sealing layer 13 can be bonded with the carrier tape 2 . Carrying out bonding, at first should be on the upper surface of upper surface layer 11, the both sides end faces of loam cake 1 and the lower surface of heat seal layer 13 are coated with antistatic agent, form antistatic layer 21,14,22 respectively, as figure 2 As shown, the antistatic layer 21, 14, 22 has formed an integral antistatic layer, and when the upper cover is pulled away, the antistatic effect of the upper surface of the upper surface layer 11 and...

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Abstract

The invention discloses a method for dissipating charges on the end face of a cover tape, which is used in the process of producing the electronic parts for the electronic carrier tapes and the covertapes. The cover tape comprises an upper surface layer, an intermediate layer and a heat sealing layer from top to bottom in sequence. The heat sealing layer can be bonded with a carrier tape. When bonding is carried out, first antistatic agents are coated on the upper surface of the upper surface layer, the end faces at both sides of the cover tape and the lower surface of the heat sealing layer,so that the end faces of the cover tape, the upper surface of the upper surface layer and the lower surface of the heat sealing layer are connected to form a whole antistatic layer. In the previous method, when static electricity appears, the static electricity generated above can only be dissipated by the upper surface layer and the static electricity generated below can only be dissipated by the lower surface layer. The method of the invention is characterized by dissipating the static electricity as a whole due to upper and lower connection, doubling the dissipation speed and further ensuring the uniformity of the bonding strength of the cover tape and the carrier tape, and effectively improves the adhesiveness and antistatic property, which can not be reached by the previous method.

Description

technical field [0001] The invention is applied to the method for eliminating static electricity on the cover tape of the electronic component. This method is applied to packaging, transportation and robotic arm to automatically take out the electronic components on the carrier tape and assemble them on the circuit board. More particularly, the present invention is directed to an apparatus and method for uniform sealing and peeling of cover tapes to eliminate static electricity and save static agents to more effectively protect electronic components. Background technique [0002] The existing method adopts the method of wrapping the tape roll of the electronic component conveying belt (electronic component conveying body). In this way, the electronic component is placed into the groove on the carrier tape that matches the original through an automatic component feeder, etc., and a plastic cover with a thickness of 50-60 microns is covered on the carrier tape. The cover tap...

Claims

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Application Information

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IPC IPC(8): B65D65/40B65D65/42B65D73/02B65D75/30B65D75/34B65D75/36B32B33/00
Inventor 陈伯达
Owner LIANMENG ELECTRONICS TECH KUSN
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